JPS58110028A - 固体電解コンデンサの製造方法 - Google Patents
固体電解コンデンサの製造方法Info
- Publication number
- JPS58110028A JPS58110028A JP21380381A JP21380381A JPS58110028A JP S58110028 A JPS58110028 A JP S58110028A JP 21380381 A JP21380381 A JP 21380381A JP 21380381 A JP21380381 A JP 21380381A JP S58110028 A JPS58110028 A JP S58110028A
- Authority
- JP
- Japan
- Prior art keywords
- carbon
- layer
- resin
- solid electrolytic
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 67
- 229910052799 carbon Inorganic materials 0.000 claims description 65
- 239000003990 capacitor Substances 0.000 claims description 44
- 239000010410 layer Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 38
- 230000001070 adhesive effect Effects 0.000 claims description 37
- 239000003973 paint Substances 0.000 claims description 32
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000011247 coating layer Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 239000003792 electrolyte Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000002023 wood Substances 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 241000255925 Diptera Species 0.000 claims 1
- 239000013043 chemical agent Substances 0.000 claims 1
- 235000013399 edible fruits Nutrition 0.000 claims 1
- 239000000088 plastic resin Substances 0.000 claims 1
- 239000007784 solid electrolyte Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 239000010408 film Substances 0.000 description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 15
- 229910052709 silver Inorganic materials 0.000 description 15
- 239000004332 silver Substances 0.000 description 15
- 238000013508 migration Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 239000002966 varnish Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000035882 stress Effects 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 241000283070 Equus zebra Species 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 241000375392 Tana Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21380381A JPS58110028A (ja) | 1981-12-23 | 1981-12-23 | 固体電解コンデンサの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21380381A JPS58110028A (ja) | 1981-12-23 | 1981-12-23 | 固体電解コンデンサの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58110028A true JPS58110028A (ja) | 1983-06-30 |
| JPS6139727B2 JPS6139727B2 (enrdf_load_html_response) | 1986-09-05 |
Family
ID=16645300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21380381A Granted JPS58110028A (ja) | 1981-12-23 | 1981-12-23 | 固体電解コンデンサの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58110028A (enrdf_load_html_response) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923729U (ja) * | 1982-08-05 | 1984-02-14 | 日立コンデンサ株式会社 | チツプ型固体電解コンデンサ |
| JPS60160605A (ja) * | 1984-01-31 | 1985-08-22 | 日本電気株式会社 | 固体電解コンデンサ |
| JPS63115321A (ja) * | 1986-10-31 | 1988-05-19 | 日立化成工業株式会社 | 固体電解コンデンサ |
| JPH02265234A (ja) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ |
| JPH0722283A (ja) * | 1993-06-22 | 1995-01-24 | Nec Corp | 固体電解コンデンサおよびその製造方法 |
| JP2004079838A (ja) * | 2002-08-20 | 2004-03-11 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
| JP2007036146A (ja) * | 2005-07-29 | 2007-02-08 | Showa Denko Kk | 電子部品及びその製造方法 |
-
1981
- 1981-12-23 JP JP21380381A patent/JPS58110028A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5923729U (ja) * | 1982-08-05 | 1984-02-14 | 日立コンデンサ株式会社 | チツプ型固体電解コンデンサ |
| JPS60160605A (ja) * | 1984-01-31 | 1985-08-22 | 日本電気株式会社 | 固体電解コンデンサ |
| JPS63115321A (ja) * | 1986-10-31 | 1988-05-19 | 日立化成工業株式会社 | 固体電解コンデンサ |
| JPH02265234A (ja) * | 1989-04-05 | 1990-10-30 | Matsushita Electric Ind Co Ltd | 固体電解コンデンサ |
| JPH0722283A (ja) * | 1993-06-22 | 1995-01-24 | Nec Corp | 固体電解コンデンサおよびその製造方法 |
| JP2004079838A (ja) * | 2002-08-20 | 2004-03-11 | Sanyo Electric Co Ltd | 固体電解コンデンサ |
| JP2007036146A (ja) * | 2005-07-29 | 2007-02-08 | Showa Denko Kk | 電子部品及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6139727B2 (enrdf_load_html_response) | 1986-09-05 |