JPS5810839A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5810839A
JPS5810839A JP56111177A JP11117781A JPS5810839A JP S5810839 A JPS5810839 A JP S5810839A JP 56111177 A JP56111177 A JP 56111177A JP 11117781 A JP11117781 A JP 11117781A JP S5810839 A JPS5810839 A JP S5810839A
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
frame
lead
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56111177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628033B2 (enrdf_load_html_response
Inventor
Takashi Kondo
隆 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56111177A priority Critical patent/JPS5810839A/ja
Publication of JPS5810839A publication Critical patent/JPS5810839A/ja
Publication of JPS628033B2 publication Critical patent/JPS628033B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56111177A 1981-07-14 1981-07-14 半導体装置 Granted JPS5810839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56111177A JPS5810839A (ja) 1981-07-14 1981-07-14 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56111177A JPS5810839A (ja) 1981-07-14 1981-07-14 半導体装置

Publications (2)

Publication Number Publication Date
JPS5810839A true JPS5810839A (ja) 1983-01-21
JPS628033B2 JPS628033B2 (enrdf_load_html_response) 1987-02-20

Family

ID=14554435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56111177A Granted JPS5810839A (ja) 1981-07-14 1981-07-14 半導体装置

Country Status (1)

Country Link
JP (1) JPS5810839A (enrdf_load_html_response)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028255A (ja) * 1983-07-26 1985-02-13 Oki Electric Ind Co Ltd 半導体装置
JPH0287661A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体記憶装置
WO1991014282A1 (fr) * 1990-03-15 1991-09-19 Fujitsu Limited Dispositif semiconducteur a puces multiples
JPH05129517A (ja) * 1991-05-11 1993-05-25 Goldstar Electron Co Ltd 積層型半導体パツケージ及びその製造方法
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8714236B2 (en) 2007-01-10 2014-05-06 John C. Karamanos Embedded heat exchanger for heating, ventilatiion, and air conditioning (HVAC) systems and methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device
JPS5617050A (en) * 1979-07-20 1981-02-18 Nec Corp Semiconductor device
JPS5624955A (en) * 1979-08-07 1981-03-10 Fujitsu Ltd Semiconductor device
JPS5662351A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor device for memory

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5487173A (en) * 1977-12-23 1979-07-11 Hitachi Ltd Semiconductor device
JPS5617050A (en) * 1979-07-20 1981-02-18 Nec Corp Semiconductor device
JPS5624955A (en) * 1979-08-07 1981-03-10 Fujitsu Ltd Semiconductor device
JPS5662351A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Semiconductor device for memory

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028255A (ja) * 1983-07-26 1985-02-13 Oki Electric Ind Co Ltd 半導体装置
JPH0287661A (ja) * 1988-09-26 1990-03-28 Nec Corp 半導体記憶装置
WO1991014282A1 (fr) * 1990-03-15 1991-09-19 Fujitsu Limited Dispositif semiconducteur a puces multiples
US5530292A (en) * 1990-03-15 1996-06-25 Fujitsu Limited Semiconductor device having a plurality of chips
JPH05129517A (ja) * 1991-05-11 1993-05-25 Goldstar Electron Co Ltd 積層型半導体パツケージ及びその製造方法

Also Published As

Publication number Publication date
JPS628033B2 (enrdf_load_html_response) 1987-02-20

Similar Documents

Publication Publication Date Title
US5637828A (en) High density semiconductor package
US6261865B1 (en) Multi chip semiconductor package and method of construction
EP0478250A1 (en) Integrated circuit device and method to prevent cracking during surface mount
JPH0831560B2 (ja) 回路パツケージ・アセンブリ
JPH0786477A (ja) 回路パッケージおよびその形成方法
JPS5810839A (ja) 半導体装置
JPS6159860A (ja) 半導体集積回路装置の製造方法
JP2737332B2 (ja) 集積回路装置
JPS6035552A (ja) 半導体装置
JPS6336686Y2 (enrdf_load_html_response)
JPS6118157A (ja) 半導体装置
JPS60262434A (ja) 半導体装置
JPS5989447A (ja) 半導体装置
JPS6321860A (ja) 半導体装置
JPH03169057A (ja) 半導体装置
JP3115432B2 (ja) 半導体装置
JPS59225553A (ja) 半導体装置
JPS62219531A (ja) 半導体集積回路装置
JPS6285455A (ja) 半導体装置
JPS63131559A (ja) 半導体装置
JPS6025257A (ja) 半導体装置
JPS6254948A (ja) 樹脂封止型半導体装置
JPH02119257A (ja) 混成集積回路装置
JPH1154551A (ja) 樹脂封止型半導体装置およびその製造方法
JPS61274349A (ja) プラスチツク封止型半導体装置