JPS5775889A - Method and device for screen printing - Google Patents
Method and device for screen printingInfo
- Publication number
- JPS5775889A JPS5775889A JP15138180A JP15138180A JPS5775889A JP S5775889 A JPS5775889 A JP S5775889A JP 15138180 A JP15138180 A JP 15138180A JP 15138180 A JP15138180 A JP 15138180A JP S5775889 A JPS5775889 A JP S5775889A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- printing
- printed
- xyθ
- adjustable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007650 screen-printing Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 5
- 238000007639 printing Methods 0.000 abstract 4
- 230000003287 optical effect Effects 0.000 abstract 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0804—Machines for printing sheets
- B41F15/0813—Machines for printing sheets with flat screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138180A JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
DE19813142794 DE3142794C2 (de) | 1980-10-30 | 1981-10-28 | Siebdruckverfahren und -vorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15138180A JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5775889A true JPS5775889A (en) | 1982-05-12 |
JPH0220426B2 JPH0220426B2 (enrdf_load_stackoverflow) | 1990-05-09 |
Family
ID=15517322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15138180A Granted JPS5775889A (en) | 1980-10-30 | 1980-10-30 | Method and device for screen printing |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS5775889A (enrdf_load_stackoverflow) |
DE (1) | DE3142794C2 (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122154A (ja) * | 1983-10-06 | 1985-06-29 | アルカテル・エヌ・ブイ | スクリ−ン印刷装置 |
JPS61123543A (ja) * | 1984-11-21 | 1986-06-11 | Hitachi Ltd | スクリ−ン印刷機の版合せ方法 |
JPS61128029U (enrdf_load_stackoverflow) * | 1985-01-29 | 1986-08-11 | ||
JPS61287294A (ja) * | 1985-06-10 | 1986-12-17 | エツイオ・クルテイ | 電子回路を担体板の基準孔に対し正確にアラインメントして印刷するための方法及び装置 |
TWI566951B (zh) * | 2012-05-25 | 2017-01-21 | Micro-Tec Company Ltd | Screen printing machine |
CN110087885A (zh) * | 2016-12-26 | 2019-08-02 | 株式会社富士 | 丝网印刷机 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4864361A (en) * | 1986-09-03 | 1989-09-05 | Sanyo Electric Co., Ltd. | Screen printing machine |
US4893556A (en) * | 1987-02-23 | 1990-01-16 | Tdk Corporation | Screen printer with double doctor/squeegee, printing pressure sensor and aligning mechanism |
US4981074A (en) * | 1988-06-01 | 1991-01-01 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for screen printing |
DE3928527A1 (de) * | 1989-08-29 | 1991-03-14 | Ind Siebdruck Systeme Neckarwe | Flachbett-siebdruckmaschine zum bedrucken einer elektrischen leiterplatte |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519849A (en) * | 1978-07-31 | 1980-02-12 | Toshiba Corp | Printing of wafer for semiconductor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8007545U1 (de) * | 1980-03-19 | 1980-06-12 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Justiereinrichtung an einer siebdruckmaschine |
-
1980
- 1980-10-30 JP JP15138180A patent/JPS5775889A/ja active Granted
-
1981
- 1981-10-28 DE DE19813142794 patent/DE3142794C2/de not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5519849A (en) * | 1978-07-31 | 1980-02-12 | Toshiba Corp | Printing of wafer for semiconductor |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60122154A (ja) * | 1983-10-06 | 1985-06-29 | アルカテル・エヌ・ブイ | スクリ−ン印刷装置 |
JPS61123543A (ja) * | 1984-11-21 | 1986-06-11 | Hitachi Ltd | スクリ−ン印刷機の版合せ方法 |
JPS61128029U (enrdf_load_stackoverflow) * | 1985-01-29 | 1986-08-11 | ||
JPS61287294A (ja) * | 1985-06-10 | 1986-12-17 | エツイオ・クルテイ | 電子回路を担体板の基準孔に対し正確にアラインメントして印刷するための方法及び装置 |
TWI566951B (zh) * | 2012-05-25 | 2017-01-21 | Micro-Tec Company Ltd | Screen printing machine |
CN110087885A (zh) * | 2016-12-26 | 2019-08-02 | 株式会社富士 | 丝网印刷机 |
CN110087885B (zh) * | 2016-12-26 | 2021-06-29 | 株式会社富士 | 丝网印刷机 |
Also Published As
Publication number | Publication date |
---|---|
DE3142794A1 (de) | 1982-05-19 |
JPH0220426B2 (enrdf_load_stackoverflow) | 1990-05-09 |
DE3142794C2 (de) | 1983-11-10 |
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