JPS577139A - Splitting of semiconductor wafer - Google Patents

Splitting of semiconductor wafer

Info

Publication number
JPS577139A
JPS577139A JP8181980A JP8181980A JPS577139A JP S577139 A JPS577139 A JP S577139A JP 8181980 A JP8181980 A JP 8181980A JP 8181980 A JP8181980 A JP 8181980A JP S577139 A JPS577139 A JP S577139A
Authority
JP
Japan
Prior art keywords
wafer
splitting
cuttings
roller
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8181980A
Other languages
English (en)
Other versions
JPS6135699B2 (ja
Inventor
Toru Tachikawa
Eizo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8181980A priority Critical patent/JPS577139A/ja
Publication of JPS577139A publication Critical patent/JPS577139A/ja
Publication of JPS6135699B2 publication Critical patent/JPS6135699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP8181980A 1980-06-16 1980-06-16 Splitting of semiconductor wafer Granted JPS577139A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8181980A JPS577139A (en) 1980-06-16 1980-06-16 Splitting of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8181980A JPS577139A (en) 1980-06-16 1980-06-16 Splitting of semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS577139A true JPS577139A (en) 1982-01-14
JPS6135699B2 JPS6135699B2 (ja) 1986-08-14

Family

ID=13757091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8181980A Granted JPS577139A (en) 1980-06-16 1980-06-16 Splitting of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS577139A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6490156A (en) * 1987-09-29 1989-04-06 Kao Corp P-phenylenediamine derivative and its production
JP2012089721A (ja) * 2010-10-21 2012-05-10 Toshiba Corp 半導体装置の製造方法、半導体装置
CN104416682A (zh) * 2013-08-23 2015-03-18 三星钻石工业股份有限公司 基板切断装置
CN104781939A (zh) * 2012-11-23 2015-07-15 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109755177B (zh) * 2017-11-06 2021-08-10 泰科电子(上海)有限公司 掰片装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6490156A (en) * 1987-09-29 1989-04-06 Kao Corp P-phenylenediamine derivative and its production
JP2012089721A (ja) * 2010-10-21 2012-05-10 Toshiba Corp 半導体装置の製造方法、半導体装置
CN104781939A (zh) * 2012-11-23 2015-07-15 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片
KR20150087243A (ko) * 2012-11-23 2015-07-29 오스람 옵토 세미컨덕터스 게엠베하 집합체를 반도체 칩으로 분리하는 방법 및 반도체 칩
JP2016501444A (ja) * 2012-11-23 2016-01-18 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 集合体を半導体チップに個片化する方法および半導体チップ
US9728459B2 (en) 2012-11-23 2017-08-08 Osram Opto Semiconductors Gmbh Method for singulating an assemblage into semiconductor chips, and semiconductor chip
JP2017139477A (ja) * 2012-11-23 2017-08-10 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ 集合体を半導体チップに個片化する方法および半導体チップ
CN104781939B (zh) * 2012-11-23 2018-11-09 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片
CN109390282A (zh) * 2012-11-23 2019-02-26 奥斯兰姆奥普托半导体有限责任公司 用于将复合体分割成半导体芯片的方法和半导体芯片
CN104416682A (zh) * 2013-08-23 2015-03-18 三星钻石工业股份有限公司 基板切断装置

Also Published As

Publication number Publication date
JPS6135699B2 (ja) 1986-08-14

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