JPS577135A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS577135A
JPS577135A JP8180180A JP8180180A JPS577135A JP S577135 A JPS577135 A JP S577135A JP 8180180 A JP8180180 A JP 8180180A JP 8180180 A JP8180180 A JP 8180180A JP S577135 A JPS577135 A JP S577135A
Authority
JP
Japan
Prior art keywords
bonding
clamping mechanism
sample stand
stand
sent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8180180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6117137B2 (enrdf_load_stackoverflow
Inventor
Hitoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8180180A priority Critical patent/JPS577135A/ja
Publication of JPS577135A publication Critical patent/JPS577135A/ja
Publication of JPS6117137B2 publication Critical patent/JPS6117137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)
JP8180180A 1980-06-16 1980-06-16 Wire bonding apparatus Granted JPS577135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8180180A JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8180180A JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
JPS577135A true JPS577135A (en) 1982-01-14
JPS6117137B2 JPS6117137B2 (enrdf_load_stackoverflow) 1986-05-06

Family

ID=13756583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8180180A Granted JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS577135A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186033U (enrdf_load_stackoverflow) * 1981-05-20 1982-11-26
JPS62107450U (enrdf_load_stackoverflow) * 1985-12-26 1987-07-09
US5504646A (en) * 1989-10-13 1996-04-02 Hitachi, Ltd. Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924070A (enrdf_load_stackoverflow) * 1972-06-26 1974-03-04
JPS5242666A (en) * 1975-09-30 1977-04-02 Matsushita Electric Works Ltd Device for lighting discharge lamp of high frequency
JPS5360572A (en) * 1976-11-12 1978-05-31 Shinkawa Ltd Ultrasonic wire bonding device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4924070A (enrdf_load_stackoverflow) * 1972-06-26 1974-03-04
JPS5242666A (en) * 1975-09-30 1977-04-02 Matsushita Electric Works Ltd Device for lighting discharge lamp of high frequency
JPS5360572A (en) * 1976-11-12 1978-05-31 Shinkawa Ltd Ultrasonic wire bonding device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186033U (enrdf_load_stackoverflow) * 1981-05-20 1982-11-26
JPS62107450U (enrdf_load_stackoverflow) * 1985-12-26 1987-07-09
US5504646A (en) * 1989-10-13 1996-04-02 Hitachi, Ltd. Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk
US5930073A (en) * 1989-10-13 1999-07-27 Hitachi, Ltd. Magnetic disk including protective layer having surface with magnetic disk including protrusions, and magnetic disk apparatus including the magnetic disk
US6303205B1 (en) 1989-10-13 2001-10-16 Hitachi, Ltd. Magnetic disk including protective layer having surface with protrusions, and substrate therefor

Also Published As

Publication number Publication date
JPS6117137B2 (enrdf_load_stackoverflow) 1986-05-06

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