JPS62107450U - - Google Patents

Info

Publication number
JPS62107450U
JPS62107450U JP19918785U JP19918785U JPS62107450U JP S62107450 U JPS62107450 U JP S62107450U JP 19918785 U JP19918785 U JP 19918785U JP 19918785 U JP19918785 U JP 19918785U JP S62107450 U JPS62107450 U JP S62107450U
Authority
JP
Japan
Prior art keywords
carrier unit
bonding
package
pedestal
raised
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19918785U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0230839Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985199187U priority Critical patent/JPH0230839Y2/ja
Publication of JPS62107450U publication Critical patent/JPS62107450U/ja
Application granted granted Critical
Publication of JPH0230839Y2 publication Critical patent/JPH0230839Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
JP1985199187U 1985-12-26 1985-12-26 Expired JPH0230839Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (enrdf_load_stackoverflow) 1985-12-26 1985-12-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985199187U JPH0230839Y2 (enrdf_load_stackoverflow) 1985-12-26 1985-12-26

Publications (2)

Publication Number Publication Date
JPS62107450U true JPS62107450U (enrdf_load_stackoverflow) 1987-07-09
JPH0230839Y2 JPH0230839Y2 (enrdf_load_stackoverflow) 1990-08-20

Family

ID=31160573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985199187U Expired JPH0230839Y2 (enrdf_load_stackoverflow) 1985-12-26 1985-12-26

Country Status (1)

Country Link
JP (1) JPH0230839Y2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus
JPS57186033U (enrdf_load_stackoverflow) * 1981-05-20 1982-11-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577135A (en) * 1980-06-16 1982-01-14 Mitsubishi Electric Corp Wire bonding apparatus
JPS57186033U (enrdf_load_stackoverflow) * 1981-05-20 1982-11-26

Also Published As

Publication number Publication date
JPH0230839Y2 (enrdf_load_stackoverflow) 1990-08-20

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