JPS6117137B2 - - Google Patents

Info

Publication number
JPS6117137B2
JPS6117137B2 JP55081801A JP8180180A JPS6117137B2 JP S6117137 B2 JPS6117137 B2 JP S6117137B2 JP 55081801 A JP55081801 A JP 55081801A JP 8180180 A JP8180180 A JP 8180180A JP S6117137 B2 JPS6117137 B2 JP S6117137B2
Authority
JP
Japan
Prior art keywords
package
bonding
view
workpiece
carrier belt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55081801A
Other languages
English (en)
Japanese (ja)
Other versions
JPS577135A (en
Inventor
Hitoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP8180180A priority Critical patent/JPS577135A/ja
Publication of JPS577135A publication Critical patent/JPS577135A/ja
Publication of JPS6117137B2 publication Critical patent/JPS6117137B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78743—Suction holding means
    • H01L2224/78744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP8180180A 1980-06-16 1980-06-16 Wire bonding apparatus Granted JPS577135A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8180180A JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8180180A JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
JPS577135A JPS577135A (en) 1982-01-14
JPS6117137B2 true JPS6117137B2 (enrdf_load_stackoverflow) 1986-05-06

Family

ID=13756583

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8180180A Granted JPS577135A (en) 1980-06-16 1980-06-16 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS577135A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS626687Y2 (enrdf_load_stackoverflow) * 1981-05-20 1987-02-16
JPH0230839Y2 (enrdf_load_stackoverflow) * 1985-12-26 1990-08-20
US5504646A (en) * 1989-10-13 1996-04-02 Hitachi, Ltd. Magnetic disk including protective layer having surface with protusions and magnetic disk apparatus including the magnetic disk

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144064B2 (enrdf_load_stackoverflow) * 1972-06-26 1976-11-26
JPS5242666A (en) * 1975-09-30 1977-04-02 Matsushita Electric Works Ltd Device for lighting discharge lamp of high frequency
JPS5360572A (en) * 1976-11-12 1978-05-31 Shinkawa Ltd Ultrasonic wire bonding device

Also Published As

Publication number Publication date
JPS577135A (en) 1982-01-14

Similar Documents

Publication Publication Date Title
JPH0344438B2 (enrdf_load_stackoverflow)
JPH03227537A (ja) 半導体素子用樹脂封止装置及び半導体装置の製造方法
JPS6117137B2 (enrdf_load_stackoverflow)
WO2009125520A1 (ja) ボンディング装置およびボンディング装置に用いられるボンディング対象の位置認識方法ならびにボンディング対象の位置認識プログラムを記録した記録媒体
EP0516317B1 (en) Method of locating work in automatic exposing apparatus
JPH0964085A (ja) ボンディング方法
JPS61148828A (ja) ワイヤボンデイングの検査方法
JP2701174B2 (ja) バンプ付け方法
JP3272312B2 (ja) 位置認識手段の移動装置
JP3341632B2 (ja) 導電性ボールの搭載装置
JPS60132399A (ja) 電子部品の位置規正方法
KR19990072435A (ko) 본딩장치
JPH02273949A (ja) テープボンデイング装置
US20230290666A1 (en) Semiconductor manufacturing apparatus, carrier jig, and manufacturing method of semiconductor device
JP3443181B2 (ja) ワイヤボンディング方法およびワイヤボンディング装置
JPS6249986B2 (enrdf_load_stackoverflow)
JP2574220Y2 (ja) ボンディング装置
JPH09153511A (ja) ワイヤボンダ
JP3269109B2 (ja) ボンディング方法
JPH01160093A (ja) 電子部品装着装置
JPH0744019Y2 (ja) 作業装置
JPH03227029A (ja) ダイボンディング装置
JPH0810188Y2 (ja) ボンディング装置
JPH04106939A (ja) ダイボンディング装置
JPS6329536A (ja) ワイヤボンデイング装置