JPS5745266A - Manufacture of hybrid integrated circuit - Google Patents

Manufacture of hybrid integrated circuit

Info

Publication number
JPS5745266A
JPS5745266A JP55120776A JP12077680A JPS5745266A JP S5745266 A JPS5745266 A JP S5745266A JP 55120776 A JP55120776 A JP 55120776A JP 12077680 A JP12077680 A JP 12077680A JP S5745266 A JPS5745266 A JP S5745266A
Authority
JP
Japan
Prior art keywords
film
resistor
solder
brush
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55120776A
Other languages
Japanese (ja)
Inventor
Yoshinobu Mutsukawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55120776A priority Critical patent/JPS5745266A/en
Publication of JPS5745266A publication Critical patent/JPS5745266A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To remove a nichrome oxide depositing on a gold evaporated film without damaging a resistor element by partially coating the resistor element by using a photo-resist before rubbing the surface of a substrate by means of a writing brush or a brush. CONSTITUTION:In the manufacture of a tantalum thin-film circuit which forms a circuit consisting of a conductor and the resistor 2 on the heatproof insulating substrate 3 composed of porcelain by employing the metallic thin-fims of tantalum 4, nichrome 5, gold 6, etc. and shapes a solder layer 7 to the conductor section through solder immersion treatment, the resist protective film 8 is formed on a resistor film before solder immersion treatment, and the resistor is protected mechanically. The surface of the substrate (the surface of the gold evaporated layer 6) is rubbed by means of the writing brush or the brush to remove the nichrome oxide, the resist film is removed by a parting agent and the whole is immersed in a solder tank, thus forming the solder layer 7 on the gold evaporated layer 6 of the conductor section.
JP55120776A 1980-09-01 1980-09-01 Manufacture of hybrid integrated circuit Pending JPS5745266A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55120776A JPS5745266A (en) 1980-09-01 1980-09-01 Manufacture of hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55120776A JPS5745266A (en) 1980-09-01 1980-09-01 Manufacture of hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS5745266A true JPS5745266A (en) 1982-03-15

Family

ID=14794715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55120776A Pending JPS5745266A (en) 1980-09-01 1980-09-01 Manufacture of hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS5745266A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211069A1 (en) 2017-05-19 2018-11-22 L'oreal Cosmetic hair treatment process using a cationic acrylic copolymer and a conditioning agent

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211069A1 (en) 2017-05-19 2018-11-22 L'oreal Cosmetic hair treatment process using a cationic acrylic copolymer and a conditioning agent

Similar Documents

Publication Publication Date Title
US3949275A (en) Electric thin-film circuit and method for its production
GB1441781A (en) Electric circuit fabrication
JPS5487172A (en) Manufacture for simiconductor device
JPS5745266A (en) Manufacture of hybrid integrated circuit
US3537925A (en) Method of forming a fine line apertured film
US3607476A (en) Method of manufacturing thin film circuits
JPS56124191A (en) Magnetic bubble element
JPS56150845A (en) Structure of resistor for compound integrated circuit
JPS5618446A (en) Formation of spherical salient electrode
JPS5460582A (en) Electrode wiring and its forming method in semiconductor device
JPS56101764A (en) Manufacture of hybrid integrated circuit
JPS5616928A (en) Forming method of terminal part of electronic component
JPS5713740A (en) Forming method for conductor pattern
JPS5527639A (en) Photo-resist pattern forming method
JPS6473087A (en) Formation of metallic pattern
JPS5618429A (en) Minute electrode formation
JPS54121669A (en) Manufacture of semiconductor element
JPS5555546A (en) Method of wiring semiconductor device
JPS56158421A (en) Manufacture of semiconductor device
JPS5680152A (en) Thin-film type integrated circuit device
JPS5488074A (en) Manufacture for semiconductor device
SU1828306A1 (en) Method for manufacture of thin-filmed resistors
JPS6482092A (en) Manufacture of surface colored body
JPS554970A (en) Formation of electrode or wiring layer on substrate
JPS559413A (en) Manufacturing method of thin film circuit