JPS57199221A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57199221A JPS57199221A JP56084599A JP8459981A JPS57199221A JP S57199221 A JPS57199221 A JP S57199221A JP 56084599 A JP56084599 A JP 56084599A JP 8459981 A JP8459981 A JP 8459981A JP S57199221 A JPS57199221 A JP S57199221A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- layer
- polycrystal silicon
- constitution
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/149—Source or drain regions of field-effect devices
- H10D62/151—Source or drain regions of field-effect devices of IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/01—Manufacture or treatment
- H10D10/051—Manufacture or treatment of vertical BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/021—Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/258—Source or drain electrodes for field-effect devices characterised by the relative positions of the source or drain electrodes with respect to the gate electrode
-
- H10P76/4085—
Landscapes
- Bipolar Transistors (AREA)
- Drying Of Semiconductors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56084599A JPS57199221A (en) | 1981-06-02 | 1981-06-02 | Manufacture of semiconductor device |
| EP82104717A EP0066280B1 (en) | 1981-06-02 | 1982-05-28 | Method for manufacturing semiconductor device |
| DE8282104717T DE3278181D1 (en) | 1981-06-02 | 1982-05-28 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56084599A JPS57199221A (en) | 1981-06-02 | 1981-06-02 | Manufacture of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57199221A true JPS57199221A (en) | 1982-12-07 |
| JPH0437580B2 JPH0437580B2 (enExample) | 1992-06-19 |
Family
ID=13835142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56084599A Granted JPS57199221A (en) | 1981-06-02 | 1981-06-02 | Manufacture of semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0066280B1 (enExample) |
| JP (1) | JPS57199221A (enExample) |
| DE (1) | DE3278181D1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933829A (ja) * | 1982-08-20 | 1984-02-23 | Hitachi Ltd | 半導体装置の製造方法 |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0173953B1 (en) * | 1984-08-28 | 1991-07-17 | Kabushiki Kaisha Toshiba | Method for manufacturing a semiconductor device having a gate electrode |
| US4658496A (en) * | 1984-11-29 | 1987-04-21 | Siemens Aktiengesellschaft | Method for manufacturing VLSI MOS-transistor circuits |
| GB2178593B (en) * | 1985-08-02 | 1989-07-26 | Stc Plc | Transistor manufacture |
| US5005066A (en) * | 1987-06-02 | 1991-04-02 | Texas Instruments Incorporated | Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology |
| US4784966A (en) * | 1987-06-02 | 1988-11-15 | Texas Instruments Incorporated | Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology |
| US4774204A (en) * | 1987-06-02 | 1988-09-27 | Texas Instruments Incorporated | Method for forming self-aligned emitters and bases and source/drains in an integrated circuit |
| GB2214349B (en) * | 1988-01-19 | 1991-06-26 | Standard Microsyst Smc | Process for fabricating mos devices |
| EP0764974B1 (en) * | 1990-03-08 | 2006-06-14 | Fujitsu Limited | Layer structure having contact hole and method of producing the same |
| JPH08321512A (ja) * | 1995-05-25 | 1996-12-03 | Murata Mfg Co Ltd | 電界効果トランジスタとその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5563827A (en) * | 1978-11-03 | 1980-05-14 | Ibm | Method of forming narrow mask opening in silicon substrate |
| JPS57112028A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Manufacture of semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4256514A (en) * | 1978-11-03 | 1981-03-17 | International Business Machines Corporation | Method for forming a narrow dimensioned region on a body |
-
1981
- 1981-06-02 JP JP56084599A patent/JPS57199221A/ja active Granted
-
1982
- 1982-05-28 EP EP82104717A patent/EP0066280B1/en not_active Expired
- 1982-05-28 DE DE8282104717T patent/DE3278181D1/de not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5563827A (en) * | 1978-11-03 | 1980-05-14 | Ibm | Method of forming narrow mask opening in silicon substrate |
| JPS57112028A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Manufacture of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933829A (ja) * | 1982-08-20 | 1984-02-23 | Hitachi Ltd | 半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0066280A3 (en) | 1985-01-23 |
| DE3278181D1 (en) | 1988-04-07 |
| EP0066280B1 (en) | 1988-03-02 |
| JPH0437580B2 (enExample) | 1992-06-19 |
| EP0066280A2 (en) | 1982-12-08 |
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