GB2214349B - Process for fabricating mos devices - Google Patents
Process for fabricating mos devicesInfo
- Publication number
- GB2214349B GB2214349B GB8900029A GB8900029A GB2214349B GB 2214349 B GB2214349 B GB 2214349B GB 8900029 A GB8900029 A GB 8900029A GB 8900029 A GB8900029 A GB 8900029A GB 2214349 B GB2214349 B GB 2214349B
- Authority
- GB
- United Kingdom
- Prior art keywords
- mos devices
- fabricating mos
- fabricating
- devices
- mos
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
- H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
- H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6656—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using multiple spacer layers, e.g. multiple sidewall spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
- H01L29/66598—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET forming drain [D] and lightly doped drain [LDD] simultaneously, e.g. using implantation through the wings a T-shaped layer, or through a specially shaped layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/665—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using self aligned silicidation, i.e. salicide
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14539088A | 1988-01-19 | 1988-01-19 |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8900029D0 GB8900029D0 (en) | 1989-03-01 |
GB2214349A GB2214349A (en) | 1989-08-31 |
GB2214349B true GB2214349B (en) | 1991-06-26 |
Family
ID=22512891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8900029A Expired - Lifetime GB2214349B (en) | 1988-01-19 | 1989-01-03 | Process for fabricating mos devices |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2733082B2 (en) |
CA (1) | CA1294061C (en) |
GB (1) | GB2214349B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5102816A (en) * | 1990-03-27 | 1992-04-07 | Sematech, Inc. | Staircase sidewall spacer for improved source/drain architecture |
EP0521947A1 (en) * | 1990-03-27 | 1993-01-13 | Sematech, Inc. | Staircase sidewall spacer for improved source/drain architecture |
US5202272A (en) * | 1991-03-25 | 1993-04-13 | International Business Machines Corporation | Field effect transistor formed with deep-submicron gate |
US6153484A (en) * | 1995-06-19 | 2000-11-28 | Imec Vzw | Etching process of CoSi2 layers |
US6404343B1 (en) | 1999-06-25 | 2002-06-11 | Act Lsi Inc. | Water leakage monitoring apparatus |
US6762085B2 (en) * | 2002-10-01 | 2004-07-13 | Chartered Semiconductor Manufacturing Ltd. | Method of forming a high performance and low cost CMOS device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0066280A2 (en) * | 1981-06-02 | 1982-12-08 | Kabushiki Kaisha Toshiba | Method for manufacturing semiconductor device |
EP0088922A2 (en) * | 1982-03-16 | 1983-09-21 | Kabushiki Kaisha Toshiba | A method of forming electrodes and wiring strips on a semiconductor device |
EP0111706A1 (en) * | 1982-12-07 | 1984-06-27 | International Business Machines Corporation | Sidewall isolation for gate of field effect transistor and process for the formation thereof |
US4727038A (en) * | 1984-08-22 | 1988-02-23 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating semiconductor device |
EP0268298A2 (en) * | 1986-11-20 | 1988-05-25 | Sumitomo Electric Industries Limited | Method of producing a Schottky-barrier field effect transistor |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6269560A (en) * | 1985-09-24 | 1987-03-30 | Hitachi Ltd | Manufacture of semiconductor device |
JPS62118578A (en) * | 1985-11-18 | 1987-05-29 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
JPS62229976A (en) * | 1986-03-31 | 1987-10-08 | Toshiba Corp | Semiconductor device and manufacture thereof |
JPS62274665A (en) * | 1986-05-22 | 1987-11-28 | Nec Corp | Manufacture of semiconductor device |
US4728617A (en) * | 1986-11-04 | 1988-03-01 | Intel Corporation | Method of fabricating a MOSFET with graded source and drain regions |
-
1989
- 1989-01-03 GB GB8900029A patent/GB2214349B/en not_active Expired - Lifetime
- 1989-01-04 CA CA000587457A patent/CA1294061C/en not_active Expired - Lifetime
- 1989-01-11 JP JP1004593A patent/JP2733082B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0066280A2 (en) * | 1981-06-02 | 1982-12-08 | Kabushiki Kaisha Toshiba | Method for manufacturing semiconductor device |
EP0088922A2 (en) * | 1982-03-16 | 1983-09-21 | Kabushiki Kaisha Toshiba | A method of forming electrodes and wiring strips on a semiconductor device |
EP0111706A1 (en) * | 1982-12-07 | 1984-06-27 | International Business Machines Corporation | Sidewall isolation for gate of field effect transistor and process for the formation thereof |
US4727038A (en) * | 1984-08-22 | 1988-02-23 | Mitsubishi Denki Kabushiki Kaisha | Method of fabricating semiconductor device |
EP0268298A2 (en) * | 1986-11-20 | 1988-05-25 | Sumitomo Electric Industries Limited | Method of producing a Schottky-barrier field effect transistor |
Also Published As
Publication number | Publication date |
---|---|
JPH023935A (en) | 1990-01-09 |
JP2733082B2 (en) | 1998-03-30 |
CA1294061C (en) | 1992-01-07 |
GB2214349A (en) | 1989-08-31 |
GB8900029D0 (en) | 1989-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20050103 |