JPS54162978A - Manufacture of semicinductor device - Google Patents
Manufacture of semicinductor deviceInfo
- Publication number
- JPS54162978A JPS54162978A JP7152378A JP7152378A JPS54162978A JP S54162978 A JPS54162978 A JP S54162978A JP 7152378 A JP7152378 A JP 7152378A JP 7152378 A JP7152378 A JP 7152378A JP S54162978 A JPS54162978 A JP S54162978A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- mask
- substrate
- sio
- buried layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To minimize the diffusion of the N+-buried layer bt reducing the photo process down to two times with thus reduction of the working time and then providing the isolated oxide film in a short time and at a low temperature via the pressure oxidation, and thus enhancing the characteristics of the semiconductor element.
CONSTITUTION: Poly Si1c is formed to P-type Si substrate 1, and Si3N4 mask 6 is formed to inject the N-type impurity ion into layer 1c. After this, the oxidation is applied to form oxide layer 2b and N+-type buried layer 2. Mask 6 is then removed and the P-type impurity ion is injected to layer 1c to then form SiO23a and P-layer 3. Then layer 2b and 3a are removed with formation of epitaxial layer 4, and then film 4c and the surface of layer 4 are removed by etching via distortion preventing SiO24c and Si3N4 mask 6. Then the pressure oxidation is given to form desired oxide film 5 in a short time and at a low temperature. In such way, the floating diffusion can be reduced greatly and with thinned layer 4 obtained. Furthermore, the buried layer is covered with SiO2 when P-layer 1c is formed to secure a high density, and the density of the substrate can be lowered to thus reduce the capacity between the buried layer and the substrate.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7152378A JPS54162978A (en) | 1978-06-15 | 1978-06-15 | Manufacture of semicinductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7152378A JPS54162978A (en) | 1978-06-15 | 1978-06-15 | Manufacture of semicinductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54162978A true JPS54162978A (en) | 1979-12-25 |
JPS5710573B2 JPS5710573B2 (en) | 1982-02-26 |
Family
ID=13463162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7152378A Granted JPS54162978A (en) | 1978-06-15 | 1978-06-15 | Manufacture of semicinductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54162978A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6116547A (en) * | 1984-05-09 | 1986-01-24 | テキサス インスツルメンツ インコ−ポレイテツド | Method of producing mos transistor |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01150275U (en) * | 1988-04-08 | 1989-10-17 | ||
JPH01150276U (en) * | 1988-04-08 | 1989-10-17 |
-
1978
- 1978-06-15 JP JP7152378A patent/JPS54162978A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6116547A (en) * | 1984-05-09 | 1986-01-24 | テキサス インスツルメンツ インコ−ポレイテツド | Method of producing mos transistor |
Also Published As
Publication number | Publication date |
---|---|
JPS5710573B2 (en) | 1982-02-26 |
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