JPS57171599A - Low melting point cu-ag system alloy solder with excellent wetting property - Google Patents

Low melting point cu-ag system alloy solder with excellent wetting property

Info

Publication number
JPS57171599A
JPS57171599A JP5426681A JP5426681A JPS57171599A JP S57171599 A JPS57171599 A JP S57171599A JP 5426681 A JP5426681 A JP 5426681A JP 5426681 A JP5426681 A JP 5426681A JP S57171599 A JPS57171599 A JP S57171599A
Authority
JP
Japan
Prior art keywords
melting point
low melting
wetting property
system alloy
excellent wetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5426681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216752B2 (enrdf_load_stackoverflow
Inventor
Hideaki Yoshida
Masaki Morikawa
Kunio Kishida
Tadaharu Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP5426681A priority Critical patent/JPS57171599A/ja
Publication of JPS57171599A publication Critical patent/JPS57171599A/ja
Publication of JPS6216752B2 publication Critical patent/JPS6216752B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5426681A 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property Granted JPS57171599A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5426681A JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5426681A JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP7707786A Division JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材
JP7707686A Division JPS6224892A (ja) 1986-04-03 1986-04-03 めれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Publications (2)

Publication Number Publication Date
JPS57171599A true JPS57171599A (en) 1982-10-22
JPS6216752B2 JPS6216752B2 (enrdf_load_stackoverflow) 1987-04-14

Family

ID=12965760

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5426681A Granted JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Country Status (1)

Country Link
JP (1) JPS57171599A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008183612A (ja) * 2007-01-31 2008-08-14 Jfe Steel Kk レーザブレージング法
EP2650077A4 (en) * 2010-12-09 2015-10-21 Nhk Spring Co Ltd BRASURE MATERIAL FOR ATMOSPHERE BONDING, BRAZED OBJECT, AND CURRENT COLLECTOR MATERIAL
WO2016159316A1 (ja) * 2015-03-31 2016-10-06 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
KR20190113542A (ko) * 2018-03-28 2019-10-08 스미토모 긴조쿠 고잔 가부시키가이샤 땜납 접합 전극 및 땜납 접합 전극의 피막 형성용 구리 합금 타깃
CN110964941A (zh) * 2019-12-27 2020-04-07 东莞正丰科技有限公司 复合炭材料银基电接触材料及其制备方法
CN116411215A (zh) * 2021-12-29 2023-07-11 无锡市蓝格林金属材料科技有限公司 一种铜钯合金线材及其制备方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008183612A (ja) * 2007-01-31 2008-08-14 Jfe Steel Kk レーザブレージング法
EP2650077A4 (en) * 2010-12-09 2015-10-21 Nhk Spring Co Ltd BRASURE MATERIAL FOR ATMOSPHERE BONDING, BRAZED OBJECT, AND CURRENT COLLECTOR MATERIAL
WO2016159316A1 (ja) * 2015-03-31 2016-10-06 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
JPWO2016159316A1 (ja) * 2015-03-31 2018-03-08 日本発條株式会社 合金材料、コンタクトプローブおよび接続端子
KR20190113542A (ko) * 2018-03-28 2019-10-08 스미토모 긴조쿠 고잔 가부시키가이샤 땜납 접합 전극 및 땜납 접합 전극의 피막 형성용 구리 합금 타깃
JP2019173094A (ja) * 2018-03-28 2019-10-10 住友金属鉱山株式会社 はんだ接合電極およびはんだ接合電極の被膜形成用銅合金ターゲット
CN110317969A (zh) * 2018-03-28 2019-10-11 住友金属矿山株式会社 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶
CN110317969B (zh) * 2018-03-28 2022-01-14 住友金属矿山株式会社 焊料接合电极以及焊料接合电极的覆膜形成用铜合金靶
TWI761657B (zh) * 2018-03-28 2022-04-21 日商住友金屬鑛山股份有限公司 焊接接合電極及焊接接合電極之覆膜形成用銅合金靶
CN110964941A (zh) * 2019-12-27 2020-04-07 东莞正丰科技有限公司 复合炭材料银基电接触材料及其制备方法
CN116411215A (zh) * 2021-12-29 2023-07-11 无锡市蓝格林金属材料科技有限公司 一种铜钯合金线材及其制备方法

Also Published As

Publication number Publication date
JPS6216752B2 (enrdf_load_stackoverflow) 1987-04-14

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