JPS57168109A - Device for measuring thickness of work piece in lapping plate - Google Patents

Device for measuring thickness of work piece in lapping plate

Info

Publication number
JPS57168109A
JPS57168109A JP56053865A JP5386581A JPS57168109A JP S57168109 A JPS57168109 A JP S57168109A JP 56053865 A JP56053865 A JP 56053865A JP 5386581 A JP5386581 A JP 5386581A JP S57168109 A JPS57168109 A JP S57168109A
Authority
JP
Japan
Prior art keywords
work piece
flat plate
distance
lower flat
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56053865A
Other languages
English (en)
Inventor
Kiyoo Katagiri
Mitsuo Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Original Assignee
Naoetsu Electronics Co Ltd
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naoetsu Electronics Co Ltd, Shin Etsu Engineering Co Ltd filed Critical Naoetsu Electronics Co Ltd
Priority to JP56053865A priority Critical patent/JPS57168109A/ja
Priority to US06/364,799 priority patent/US4433510A/en
Priority to DE3213252A priority patent/DE3213252C2/de
Publication of JPS57168109A publication Critical patent/JPS57168109A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP56053865A 1981-04-10 1981-04-10 Device for measuring thickness of work piece in lapping plate Pending JPS57168109A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56053865A JPS57168109A (en) 1981-04-10 1981-04-10 Device for measuring thickness of work piece in lapping plate
US06/364,799 US4433510A (en) 1981-04-10 1982-04-02 Method for controlling thickness of wafer-like work pieces under lapping and a lapping machine therefor
DE3213252A DE3213252C2 (de) 1981-04-10 1982-04-08 Verfahren zur Inprozeß-Messung der Dicke von waferartigen Werkstücken und Zweischeiben-Läppmaschine hierfür

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56053865A JPS57168109A (en) 1981-04-10 1981-04-10 Device for measuring thickness of work piece in lapping plate

Publications (1)

Publication Number Publication Date
JPS57168109A true JPS57168109A (en) 1982-10-16

Family

ID=12954655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56053865A Pending JPS57168109A (en) 1981-04-10 1981-04-10 Device for measuring thickness of work piece in lapping plate

Country Status (3)

Country Link
US (1) US4433510A (ja)
JP (1) JPS57168109A (ja)
DE (1) DE3213252C2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548786A (en) * 1983-04-28 1985-10-22 General Electric Company Coated carbide cutting tool insert
JPS62188671A (ja) * 1986-02-13 1987-08-18 Supiide Fuamu Kk 平面研磨機における定寸装置
JPS6347051A (ja) * 1986-08-13 1988-02-27 Hitachi Ltd 両面研削装置の砥石形状検出方法および砥石形状検出手段を備えた両面研削装置
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2564360B1 (fr) * 1984-05-21 1986-10-17 Crismatec Machine d'usinage double face et dispositif de transmission de courant et de fluide entre une structure tournante et une structure non tournante
JPH0243655Y2 (ja) * 1985-07-05 1990-11-20
IT1190231B (it) * 1986-03-07 1988-02-16 Melchiorre Off Mecc Lappatrice a due plato' con dispositivo per la misura spessore del pezzo in lavorazione e con tavola di caricamento manuale dei satelliti
CH670971A5 (ja) * 1986-10-03 1989-07-31 Oerlikon Buehrle Ag
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
GB2241063B (en) * 1990-02-14 1994-01-05 Rolls Royce Plc Monitoring a machining operation
US5242524A (en) * 1990-05-16 1993-09-07 International Business Machines Corporation Device for detecting an end point in polishing operations
US5132617A (en) * 1990-05-16 1992-07-21 International Business Machines Corp. Method of measuring changes in impedance of a variable impedance load by disposing an impedance connected coil within the air gap of a magnetic core
IT1243537B (it) * 1990-10-19 1994-06-16 Melchiorre Off Mecc Metodo e dispositivo per il controllo al termine di ogni ciclo (post process) dei pezzi lavorati in una macchina lappatrice a doppio plateau
US5663637A (en) * 1996-03-19 1997-09-02 International Business Machines Corporation Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool
JPH1034529A (ja) * 1996-07-18 1998-02-10 Speedfam Co Ltd 自動定寸装置
US5980366A (en) * 1997-12-08 1999-11-09 Speedfam-Ipec Corporation Methods and apparatus for polishing using an improved plate stabilizer
US6168506B1 (en) * 1998-01-21 2001-01-02 Speedfam-Ipec Corporation Apparatus for polishing using improved plate supports
US6132289A (en) * 1998-03-31 2000-10-17 Lam Research Corporation Apparatus and method for film thickness measurement integrated into a wafer load/unload unit
US6258177B1 (en) 1999-03-29 2001-07-10 Seh America Apparatus for cleaning the grooves of lapping plates
US6196907B1 (en) * 1999-10-01 2001-03-06 U.S. Dynamics Corporation Slurry delivery system for a metal polisher
DE10196239T1 (de) 2000-05-25 2003-08-07 Seagate Technology Llc Verbesserter Lapping-Sensor für Aufzeichnungsköpfe
US6887127B2 (en) * 2001-04-02 2005-05-03 Murata Manufacturing Co., Ltd. Polishing apparatus
JP3806680B2 (ja) * 2002-08-13 2006-08-09 大昌精機株式会社 竪型両頭平面研削盤における研削方法
JP4659338B2 (ja) * 2003-02-12 2011-03-30 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド
JP2005199387A (ja) * 2004-01-15 2005-07-28 Fujikoshi Mach Corp 両面研磨装置
JP2006231471A (ja) * 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機とその定寸制御方法
JP2006231470A (ja) * 2005-02-25 2006-09-07 Speedfam Co Ltd 両面ポリッシュ加工機の定寸方法及び定寸装置
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
DE102009024125B4 (de) * 2009-06-06 2023-07-27 Lapmaster Wolters Gmbh Verfahren zum Bearbeiten von flachen Werkstücken
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102011082857B4 (de) 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
US9308622B2 (en) 2013-10-18 2016-04-12 Seagate Technology Llc Lapping head with a sensor device on the rotating lapping head
KR101660900B1 (ko) * 2015-01-16 2016-10-10 주식회사 엘지실트론 웨이퍼 연마 장치 및 이를 이용한 웨이퍼 연마 방법
DE102016116012A1 (de) * 2016-08-29 2018-03-01 Lapmaster Wolters Gmbh Verfahren zum Messen der Dicke von flachen Werkstücken
KR101881379B1 (ko) * 2016-11-28 2018-08-24 에스케이실트론 주식회사 정반 세정 장치
JP7296161B1 (ja) * 2022-06-27 2023-06-22 不二越機械工業株式会社 両面研磨装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3089292A (en) * 1961-04-14 1963-05-14 Norton Co Lapping machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548786A (en) * 1983-04-28 1985-10-22 General Electric Company Coated carbide cutting tool insert
JPS62188671A (ja) * 1986-02-13 1987-08-18 Supiide Fuamu Kk 平面研磨機における定寸装置
JPS6347051A (ja) * 1986-08-13 1988-02-27 Hitachi Ltd 両面研削装置の砥石形状検出方法および砥石形状検出手段を備えた両面研削装置
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine

Also Published As

Publication number Publication date
US4433510A (en) 1984-02-28
DE3213252C2 (de) 1986-12-11
DE3213252A1 (de) 1982-12-09

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