JPS6445568A - Automatic dimensioning of lapping machine - Google Patents

Automatic dimensioning of lapping machine

Info

Publication number
JPS6445568A
JPS6445568A JP62200584A JP20058487A JPS6445568A JP S6445568 A JPS6445568 A JP S6445568A JP 62200584 A JP62200584 A JP 62200584A JP 20058487 A JP20058487 A JP 20058487A JP S6445568 A JPS6445568 A JP S6445568A
Authority
JP
Japan
Prior art keywords
lapping
time
relation
lapping machine
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62200584A
Other languages
Japanese (ja)
Inventor
Toshio Omori
Keiichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON SILICONE KK
Mitsubishi Materials Silicon Corp
Mitsubishi Metal Corp
Original Assignee
NIPPON SILICONE KK
Mitsubishi Metal Corp
Japan Silicon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON SILICONE KK, Mitsubishi Metal Corp, Japan Silicon Co Ltd filed Critical NIPPON SILICONE KK
Priority to JP62200584A priority Critical patent/JPS6445568A/en
Publication of JPS6445568A publication Critical patent/JPS6445568A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve dimensioning accuracy by compensating the detection value of feed per revolution of a lapping machine from the relation between a predicted lapping time and abrasion loss of the lapping machine at the time of initial lapping, and thereafter compensating the above relation based on the measured value of the number of lappings at the time of lapping. CONSTITUTION:When the thickness of a work W during lapping is evaluated from feed per revolution of a lapping machine 1, the detection value of feed per revolution of the lapping machine 1 is compensated from the relation between a predicted lapping time and abrasion loss of the lapping machine 1 (the relation obtained from the lapping operations performed up to that time) at the time of initial lapping. And thereafter at the time of lapping, the above relation between the predicted lapping time and abrasion loss is corrected based on the measured value of the thickness of the work W after lapping, the detection value of feed per revolution of the lapping machine 1 is compensated from the corrected relation, and as a result, the dimensioning accuracy can be improved.
JP62200584A 1987-08-11 1987-08-11 Automatic dimensioning of lapping machine Pending JPS6445568A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62200584A JPS6445568A (en) 1987-08-11 1987-08-11 Automatic dimensioning of lapping machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62200584A JPS6445568A (en) 1987-08-11 1987-08-11 Automatic dimensioning of lapping machine

Publications (1)

Publication Number Publication Date
JPS6445568A true JPS6445568A (en) 1989-02-20

Family

ID=16426772

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62200584A Pending JPS6445568A (en) 1987-08-11 1987-08-11 Automatic dimensioning of lapping machine

Country Status (1)

Country Link
JP (1) JPS6445568A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03210052A (en) * 1990-01-12 1991-09-13 Mitsubishi Electric Corp Malfunction diagnosing device
WO2000023228A1 (en) * 1998-10-16 2000-04-27 Tokyo Seimitsu Co., Ltd. Wafer grinder and method of detecting grinding amount
GB2380960A (en) * 1998-10-16 2003-04-23 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US6918815B2 (en) 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
US6939200B2 (en) 2003-09-16 2005-09-06 Hitachi Global Storage Technologies Netherlands B.V. Method of predicting plate lapping properties to improve slider fabrication yield
JP2006231471A (en) * 2005-02-25 2006-09-07 Speedfam Co Ltd Double-sided polishing machine and its sizing controlling method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548571A (en) * 1978-10-05 1980-04-07 Toshiba Corp Machining equipment
JPS57168109A (en) * 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548571A (en) * 1978-10-05 1980-04-07 Toshiba Corp Machining equipment
JPS57168109A (en) * 1981-04-10 1982-10-16 Shinetsu Eng Kk Device for measuring thickness of work piece in lapping plate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03210052A (en) * 1990-01-12 1991-09-13 Mitsubishi Electric Corp Malfunction diagnosing device
WO2000023228A1 (en) * 1998-10-16 2000-04-27 Tokyo Seimitsu Co., Ltd. Wafer grinder and method of detecting grinding amount
GB2347102A (en) * 1998-10-16 2000-08-30 Tokyo Seimitsu Co Ltd Wafer grinder and method of detecting grinding amount
US6402589B1 (en) 1998-10-16 2002-06-11 Tokyo Seimitsu Co., Ltd. Wafer grinder and method of detecting grinding amount
GB2347102B (en) * 1998-10-16 2002-12-11 Tokyo Seimitsu Co Ltd Wafer polishing apparatus and polishing quantity detection method
GB2380960A (en) * 1998-10-16 2003-04-23 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
GB2380960B (en) * 1998-10-16 2003-06-04 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US6918815B2 (en) 2003-09-16 2005-07-19 Hitachi Global Storage Technologies Netherlands B.V. System and apparatus for predicting plate lapping properties to improve slider fabrication yield
US6939200B2 (en) 2003-09-16 2005-09-06 Hitachi Global Storage Technologies Netherlands B.V. Method of predicting plate lapping properties to improve slider fabrication yield
JP2006231471A (en) * 2005-02-25 2006-09-07 Speedfam Co Ltd Double-sided polishing machine and its sizing controlling method

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