JPS6445568A - Automatic dimensioning of lapping machine - Google Patents
Automatic dimensioning of lapping machineInfo
- Publication number
- JPS6445568A JPS6445568A JP62200584A JP20058487A JPS6445568A JP S6445568 A JPS6445568 A JP S6445568A JP 62200584 A JP62200584 A JP 62200584A JP 20058487 A JP20058487 A JP 20058487A JP S6445568 A JPS6445568 A JP S6445568A
- Authority
- JP
- Japan
- Prior art keywords
- lapping
- time
- relation
- lapping machine
- machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To improve dimensioning accuracy by compensating the detection value of feed per revolution of a lapping machine from the relation between a predicted lapping time and abrasion loss of the lapping machine at the time of initial lapping, and thereafter compensating the above relation based on the measured value of the number of lappings at the time of lapping. CONSTITUTION:When the thickness of a work W during lapping is evaluated from feed per revolution of a lapping machine 1, the detection value of feed per revolution of the lapping machine 1 is compensated from the relation between a predicted lapping time and abrasion loss of the lapping machine 1 (the relation obtained from the lapping operations performed up to that time) at the time of initial lapping. And thereafter at the time of lapping, the above relation between the predicted lapping time and abrasion loss is corrected based on the measured value of the thickness of the work W after lapping, the detection value of feed per revolution of the lapping machine 1 is compensated from the corrected relation, and as a result, the dimensioning accuracy can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62200584A JPS6445568A (en) | 1987-08-11 | 1987-08-11 | Automatic dimensioning of lapping machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62200584A JPS6445568A (en) | 1987-08-11 | 1987-08-11 | Automatic dimensioning of lapping machine |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6445568A true JPS6445568A (en) | 1989-02-20 |
Family
ID=16426772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62200584A Pending JPS6445568A (en) | 1987-08-11 | 1987-08-11 | Automatic dimensioning of lapping machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6445568A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03210052A (en) * | 1990-01-12 | 1991-09-13 | Mitsubishi Electric Corp | Malfunction diagnosing device |
WO2000023228A1 (en) * | 1998-10-16 | 2000-04-27 | Tokyo Seimitsu Co., Ltd. | Wafer grinder and method of detecting grinding amount |
GB2380960A (en) * | 1998-10-16 | 2003-04-23 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
US6918815B2 (en) | 2003-09-16 | 2005-07-19 | Hitachi Global Storage Technologies Netherlands B.V. | System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
US6939200B2 (en) | 2003-09-16 | 2005-09-06 | Hitachi Global Storage Technologies Netherlands B.V. | Method of predicting plate lapping properties to improve slider fabrication yield |
JP2006231471A (en) * | 2005-02-25 | 2006-09-07 | Speedfam Co Ltd | Double-sided polishing machine and its sizing controlling method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548571A (en) * | 1978-10-05 | 1980-04-07 | Toshiba Corp | Machining equipment |
JPS57168109A (en) * | 1981-04-10 | 1982-10-16 | Shinetsu Eng Kk | Device for measuring thickness of work piece in lapping plate |
-
1987
- 1987-08-11 JP JP62200584A patent/JPS6445568A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5548571A (en) * | 1978-10-05 | 1980-04-07 | Toshiba Corp | Machining equipment |
JPS57168109A (en) * | 1981-04-10 | 1982-10-16 | Shinetsu Eng Kk | Device for measuring thickness of work piece in lapping plate |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03210052A (en) * | 1990-01-12 | 1991-09-13 | Mitsubishi Electric Corp | Malfunction diagnosing device |
WO2000023228A1 (en) * | 1998-10-16 | 2000-04-27 | Tokyo Seimitsu Co., Ltd. | Wafer grinder and method of detecting grinding amount |
GB2347102A (en) * | 1998-10-16 | 2000-08-30 | Tokyo Seimitsu Co Ltd | Wafer grinder and method of detecting grinding amount |
US6402589B1 (en) | 1998-10-16 | 2002-06-11 | Tokyo Seimitsu Co., Ltd. | Wafer grinder and method of detecting grinding amount |
GB2347102B (en) * | 1998-10-16 | 2002-12-11 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus and polishing quantity detection method |
GB2380960A (en) * | 1998-10-16 | 2003-04-23 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
GB2380960B (en) * | 1998-10-16 | 2003-06-04 | Tokyo Seimitsu Co Ltd | Wafer polishing apparatus |
US6918815B2 (en) | 2003-09-16 | 2005-07-19 | Hitachi Global Storage Technologies Netherlands B.V. | System and apparatus for predicting plate lapping properties to improve slider fabrication yield |
US6939200B2 (en) | 2003-09-16 | 2005-09-06 | Hitachi Global Storage Technologies Netherlands B.V. | Method of predicting plate lapping properties to improve slider fabrication yield |
JP2006231471A (en) * | 2005-02-25 | 2006-09-07 | Speedfam Co Ltd | Double-sided polishing machine and its sizing controlling method |
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