JPS57164984A - Exfoliating solution for tin or tin alloy - Google Patents

Exfoliating solution for tin or tin alloy

Info

Publication number
JPS57164984A
JPS57164984A JP56050515A JP5051581A JPS57164984A JP S57164984 A JPS57164984 A JP S57164984A JP 56050515 A JP56050515 A JP 56050515A JP 5051581 A JP5051581 A JP 5051581A JP S57164984 A JPS57164984 A JP S57164984A
Authority
JP
Japan
Prior art keywords
acid
contg
exfoliating
soln
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56050515A
Other languages
English (en)
Other versions
JPH0151548B2 (ja
Inventor
Yutaka Kawabe
Masanori Kishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUKU KK
Original Assignee
METSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUKU KK filed Critical METSUKU KK
Priority to JP56050515A priority Critical patent/JPS57164984A/ja
Priority to DE19823212410 priority patent/DE3212410A1/de
Priority to GB8210057A priority patent/GB2099855A/en
Priority to US06/366,018 priority patent/US4374744A/en
Publication of JPS57164984A publication Critical patent/JPS57164984A/ja
Publication of JPH0151548B2 publication Critical patent/JPH0151548B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP56050515A 1981-04-06 1981-04-06 Exfoliating solution for tin or tin alloy Granted JPS57164984A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP56050515A JPS57164984A (en) 1981-04-06 1981-04-06 Exfoliating solution for tin or tin alloy
DE19823212410 DE3212410A1 (de) 1981-04-06 1982-04-02 Abstreifloesung fuer zinn und zinnlegierungen
GB8210057A GB2099855A (en) 1981-04-06 1982-04-05 Acidic aqueous solution for stripping tin or tin alloys from copper plate
US06/366,018 US4374744A (en) 1981-04-06 1982-04-06 Stripping solution for tin or tin alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56050515A JPS57164984A (en) 1981-04-06 1981-04-06 Exfoliating solution for tin or tin alloy

Publications (2)

Publication Number Publication Date
JPS57164984A true JPS57164984A (en) 1982-10-09
JPH0151548B2 JPH0151548B2 (ja) 1989-11-06

Family

ID=12861103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56050515A Granted JPS57164984A (en) 1981-04-06 1981-04-06 Exfoliating solution for tin or tin alloy

Country Status (4)

Country Link
US (1) US4374744A (ja)
JP (1) JPS57164984A (ja)
DE (1) DE3212410A1 (ja)
GB (1) GB2099855A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (ja) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド 剥離材
JPS59219475A (ja) * 1983-05-30 1984-12-10 Metsuku Kk 錫または錫合金の剥離液
JPH01129491A (ja) * 1987-11-16 1989-05-22 Metsuku Kk 錫または錫一鉛合金の剥離方法
US5223087A (en) * 1989-04-18 1993-06-29 Tokai Denka Kogyo Kabushiki Kaisha Chemical solubilizing agent for tin or tin alloy
JP2010111748A (ja) * 2008-11-05 2010-05-20 Mec Kk 接着層形成液及び接着層形成方法
CN105441954A (zh) * 2015-12-22 2016-03-30 安徽省春谷3D打印智能装备产业技术研究院有限公司 金属表面光亮剂材料组合物和金属表面光亮剂

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1144797B (it) * 1981-10-14 1986-10-29 Alfachimici Spa Soluzione per l asportazione di stagno o lega stagno piombo da un substrato mediante operazione a spruzzo
USRE32555E (en) * 1982-09-20 1987-12-08 Circuit Chemistry Corporation Solder stripping solution
US4704234A (en) * 1983-01-17 1987-11-03 American Cyanamid Company Compositions comprising imidazole, pyrazole or derivatives thereof for removing undesirable organic matter from a surface
US4537638A (en) * 1983-01-17 1985-08-27 American Cyanamid Co. Method for removal of undesirable organic matter
AT380493B (de) * 1984-06-18 1986-05-26 Kapsch Ag Mittel zur chemischen oberflaechenbehandlung von metallen
USRE34613E (en) * 1985-05-28 1994-05-24 Recytec Sa Process for decontaminating radioactively contaminated metal or cement-containing materials
JPS63172799A (ja) * 1987-01-12 1988-07-16 日本パ−カライジング株式会社 アルミニウムの表面洗浄剤
DE3738307A1 (de) * 1987-11-11 1989-05-24 Ruwel Werke Gmbh Badloesungen und verfahren zum entfernen von blei/zinn-, blei- bzw. zinnschichten auf kupfer- oder nickeloberflaechen
GB8829253D0 (en) * 1988-12-15 1989-01-25 Imasa Ltd Method of removing deposits of tin lead or tin/lead alloys from copper substrates and compositions for use therein
US4957653A (en) * 1989-04-07 1990-09-18 Macdermid, Incorporated Composition containing alkane sulfonic acid and ferric nitrate for stripping tin or tin-lead alloy from copper surfaces, and method for stripping tin or tin-lead alloy
US4944851A (en) * 1989-06-05 1990-07-31 Macdermid, Incorporated Electrolytic method for regenerating tin or tin-lead alloy stripping compositions
US4921571A (en) * 1989-07-28 1990-05-01 Macdermid, Incorporated Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces
JPH0375386A (ja) * 1989-08-18 1991-03-29 Metsuku Kk 錫又は錫‐鉛合金の剥離方法
US5017267A (en) * 1990-07-17 1991-05-21 Macdermid, Incorporated Composition and method for stripping tin or tin-lead alloy from copper surfaces
CH682023A5 (ja) * 1990-10-26 1993-06-30 Recytec Sa
US5234542A (en) * 1992-03-04 1993-08-10 Macdermid, Incorporated Composition and process for stripping tin from copper surfaces
DE4335716C2 (de) * 1993-04-30 2001-07-26 Ami Doduco Gmbh Verwendung eines Additives aus einem Emulgator und einem oder mehreren Inhibitoren zu einem Bad zum Entfernen von Schichten aus Nickel, Zinn, Blei oder Zinn-Blei von Oberflächen aus Kupfer oder Kupferlegierungen
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating
US5741432A (en) * 1995-01-17 1998-04-21 The Dexter Corporation Stabilized nitric acid compositions
US5911907A (en) * 1995-08-30 1999-06-15 Surface Tek Specialty Products, Inc. Composition and method for stripping tin and tin-lead from copper surfaces
TW470785B (en) 1998-02-03 2002-01-01 Atotech Deutschland Gmbh Process for preliminary treatment of copper surfaces
US6649081B1 (en) 1998-03-24 2003-11-18 Henkel Corporation Aqueous liquid deoxidizing composition and process for aluminum, with low foaming tendency
SG83733A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
SG83734A1 (en) * 1998-06-26 2001-10-16 Atotech Deutschland Gmbh Process to pretreat copper surfaces
US7351353B1 (en) * 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
EP1356502A1 (en) * 2001-01-16 2003-10-29 Cabot Microelectronics Corporation Ammonium oxalate-containing polishing system and method
TWI231831B (en) * 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition
JP4585299B2 (ja) * 2004-12-09 2010-11-24 東京応化工業株式会社 リソグラフィー用リンス液及びそれを用いたレジストパターン形成方法
CN101233601A (zh) * 2005-06-13 2008-07-30 高级技术材料公司 在金属硅化物形成后用于选择性除去金属或金属合金的组合物及方法
FI121569B (fi) * 2005-10-14 2011-01-14 Yara Suomi Oy Menetelmä metallioksidien saostamiseksi jätevesiliuoksesta
ES2348361T3 (es) * 2005-10-25 2010-12-03 Atotech Deutschland Gmbh Método para adhesión mejorada de materiales polímeros a superficies de cobre o aleaciones de cobre.
TWI516573B (zh) * 2007-02-06 2016-01-11 安堤格里斯公司 選擇性移除ＴｉＳｉＮ之組成物及方法
DE102008001792A1 (de) * 2008-05-15 2009-11-19 Robert Bosch Gmbh Verfahren zur Bestimmung der Neigung zur Bildung von Whiskern
TW201634701A (zh) 2010-04-15 2016-10-01 安堤格里斯公司 廢棄印刷電路板之回收利用方法
US20120098120A1 (en) * 2010-10-21 2012-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Centripetal layout for low stress chip package
SG11201403228RA (en) 2011-12-15 2014-07-30 Advanced Tech Materials Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US10494696B2 (en) * 2013-07-08 2019-12-03 Alpha Assembly Solution Inc. Metal recovery
TWI521097B (zh) 2014-06-25 2016-02-11 優勝奈米科技有限公司 剝錫添加劑及其應用
CN105506631A (zh) * 2016-01-29 2016-04-20 江苏净拓环保科技有限公司 一种pcb表面退锡液
US10796956B2 (en) 2018-06-29 2020-10-06 Texas Instruments Incorporated Contact fabrication to mitigate undercut
CN109898085B (zh) * 2019-04-10 2021-07-09 深圳市松柏实业发展有限公司 退锡组合液及退锡方法
CN113984465A (zh) * 2021-10-12 2022-01-28 江西洪都航空工业集团有限责任公司 一种用于溶解钎锡焊料的溶解液及溶解方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1908421C3 (de) * 1969-02-20 1978-03-30 Gerhard Collardin Gmbh, 5000 Koeln Mittel zum Ablösen von kupferhaltigen Metallüberzügen von Eisen- und Stahloberflächen
US3841905A (en) * 1970-11-19 1974-10-15 Rbp Chem Corp Method of preparing printed circuit boards with terminal tabs
JPS5221460B1 (ja) * 1971-04-26 1977-06-10
GB1446816A (en) * 1973-05-02 1976-08-18 Furukawa Electric Co Ltd Chemical dissolution treatment of tin or alloys thereof
US3926699A (en) * 1974-06-17 1975-12-16 Rbp Chemical Corp Method of preparing printed circuit boards with terminal tabs
US3990982A (en) * 1974-12-18 1976-11-09 Rbp Chemical Corporation Composition for stripping lead-tin solder
GB1565349A (en) * 1975-10-20 1980-04-16 Albright & Wilson Aluminium polishing compositions
US4297257A (en) * 1980-04-17 1981-10-27 Dart Industries Inc. Metal stripping composition and method
JPH0517336A (ja) * 1991-07-10 1993-01-26 Shiseido Co Ltd 皮膚外用剤

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58123878A (ja) * 1982-01-11 1983-07-23 エンソ−ン・インコ−ポレ−テツド 剥離材
JPS6334231B2 (ja) * 1982-01-11 1988-07-08 Ensoon Inc
JPS59219475A (ja) * 1983-05-30 1984-12-10 Metsuku Kk 錫または錫合金の剥離液
JPS6242035B2 (ja) * 1983-05-30 1987-09-05 Metsuku Kk
JPH01129491A (ja) * 1987-11-16 1989-05-22 Metsuku Kk 錫または錫一鉛合金の剥離方法
US5223087A (en) * 1989-04-18 1993-06-29 Tokai Denka Kogyo Kabushiki Kaisha Chemical solubilizing agent for tin or tin alloy
JP2010111748A (ja) * 2008-11-05 2010-05-20 Mec Kk 接着層形成液及び接着層形成方法
CN105441954A (zh) * 2015-12-22 2016-03-30 安徽省春谷3D打印智能装备产业技术研究院有限公司 金属表面光亮剂材料组合物和金属表面光亮剂

Also Published As

Publication number Publication date
GB2099855A (en) 1982-12-15
US4374744A (en) 1983-02-22
JPH0151548B2 (ja) 1989-11-06
DE3212410C2 (ja) 1988-01-07
DE3212410A1 (de) 1982-10-28

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