JPS5221460B1 - - Google Patents

Info

Publication number
JPS5221460B1
JPS5221460B1 JP46026697A JP2669771A JPS5221460B1 JP S5221460 B1 JPS5221460 B1 JP S5221460B1 JP 46026697 A JP46026697 A JP 46026697A JP 2669771 A JP2669771 A JP 2669771A JP S5221460 B1 JPS5221460 B1 JP S5221460B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP46026697A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46026697A priority Critical patent/JPS5221460B1/ja
Priority to US00183618A priority patent/US3770530A/en
Priority to GB4564371A priority patent/GB1344159A/en
Priority to DE2149196A priority patent/DE2149196C2/de
Priority to FR717137364A priority patent/FR2134333B1/fr
Priority to IT31825/71A priority patent/IT941866B/it
Publication of JPS5221460B1 publication Critical patent/JPS5221460B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
JP46026697A 1971-04-26 1971-04-26 Pending JPS5221460B1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP46026697A JPS5221460B1 (ja) 1971-04-26 1971-04-26
US00183618A US3770530A (en) 1971-04-26 1971-09-24 Method of etching copper and alloys thereof
GB4564371A GB1344159A (en) 1971-04-26 1971-09-30 Acidic etching solution and a method of etching copper and copper alloys therewith
DE2149196A DE2149196C2 (de) 1971-04-26 1971-10-01 Verfahren und Lösung zum Ätzen von Kupfer oder Kupferlegierungen
FR717137364A FR2134333B1 (ja) 1971-04-26 1971-10-18
IT31825/71A IT941866B (it) 1971-04-26 1971-11-30 Metodo per l attacco chimico di rame e sue leghe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46026697A JPS5221460B1 (ja) 1971-04-26 1971-04-26

Publications (1)

Publication Number Publication Date
JPS5221460B1 true JPS5221460B1 (ja) 1977-06-10

Family

ID=12200566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46026697A Pending JPS5221460B1 (ja) 1971-04-26 1971-04-26

Country Status (6)

Country Link
US (1) US3770530A (ja)
JP (1) JPS5221460B1 (ja)
DE (1) DE2149196C2 (ja)
FR (1) FR2134333B1 (ja)
GB (1) GB1344159A (ja)
IT (1) IT941866B (ja)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332341B2 (ja) * 1973-03-27 1978-09-07
JPS533975B2 (ja) * 1973-10-17 1978-02-13 Tokai Electro Chemical Co
JPS5224508B2 (ja) * 1973-11-19 1977-07-01 Tokai Electro Chemical Co
SE400575B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for betning av koppar och dess legeringar
SE400581B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for kemisk polering av koppar och dess legeringar
JPS57164984A (en) * 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy
FR2513258A1 (fr) * 1981-09-21 1983-03-25 Dart Ind Inc Solution aqueuse de peroxyde d'hydrogene stabilisee au 3-amino-1,2,4-triazole et son procede de stabilisation
DE3305319A1 (de) * 1983-02-16 1984-08-16 Siemens AG, 1000 Berlin und 8000 München Elektrolytisches vollregenerierverfahren einer ammoniakalischen aetzloesung
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
FR2656630A1 (fr) * 1990-01-02 1991-07-05 Produits Ind Cie Fse Nouvelle application de l'aminotriazole, composition le contenant et son procede de mise en óoeuvre.
IT1251431B (it) * 1991-10-25 1995-05-09 Costante Fontana Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali
JPH06287774A (ja) * 1993-04-05 1994-10-11 Metsuku Kk 銅および銅合金の表面処理剤
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
US5911907A (en) * 1995-08-30 1999-06-15 Surface Tek Specialty Products, Inc. Composition and method for stripping tin and tin-lead from copper surfaces
TW374802B (en) * 1996-07-29 1999-11-21 Ebara Densan Ltd Etching composition, method for roughening copper surface and method for producing printed wiring board
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6162366A (en) * 1997-12-25 2000-12-19 Canon Kabushiki Kaisha Etching process
DE19830038C2 (de) * 1998-02-03 2001-08-02 Atotech Deutschland Gmbh Lösung und Verfahren zum Vorbehandeln von Kupferoberflächen
TW470785B (en) 1998-02-03 2002-01-01 Atotech Deutschland Gmbh Process for preliminary treatment of copper surfaces
TW460622B (en) 1998-02-03 2001-10-21 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
DE10066028C2 (de) * 2000-07-07 2003-04-24 Atotech Deutschland Gmbh Kupfersubstrat mit aufgerauhten Oberflächen
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
WO2002061810A1 (en) * 2001-01-16 2002-08-08 Cabot Microelectronics Corporation Ammonium oxalate-containing polishing system and method
JP4687852B2 (ja) * 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 銅および銅合金の表面処理剤
DE10313517B4 (de) * 2003-03-25 2006-03-30 Atotech Deutschland Gmbh Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
EP1820884B1 (en) * 2006-02-17 2009-10-07 Atotech Deutschland Gmbh Solution and process to treat surfaces of copper alloys in order to improve the adhesion between the metal surface and the bonded polymeric material
US20070228011A1 (en) * 2006-03-31 2007-10-04 Buehler Mark F Novel chemical composition to reduce defects
JP2011179085A (ja) * 2010-03-02 2011-09-15 C Uyemura & Co Ltd 電気めっき用前処理剤、電気めっきの前処理方法及び電気めっき方法
EP3159432B1 (en) * 2015-10-23 2020-08-05 ATOTECH Deutschland GmbH Surface treatment agent for copper and copper alloy surfaces
CN108601231A (zh) * 2018-04-09 2018-09-28 常州海弘电子有限公司 一种印制线路板的生产工艺及测试方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU37394A1 (ja) * 1959-07-13
US3216873A (en) * 1961-08-04 1965-11-09 Fmc Corp Method of etching photoengraving plates and etching solution used therefor
US3476624A (en) * 1966-02-08 1969-11-04 Fmc Corp Process of etching copper circuits
GB1124904A (en) * 1967-07-13 1968-08-21 Shell Int Research Improvements in or relating to lubricating greases

Also Published As

Publication number Publication date
FR2134333B1 (ja) 1974-06-21
FR2134333A1 (ja) 1972-12-08
US3770530A (en) 1973-11-06
DE2149196A1 (de) 1972-11-02
GB1344159A (en) 1974-01-16
DE2149196C2 (de) 1982-04-29
IT941866B (it) 1973-03-10

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