JPS57132965A - One pass type multi-head plane grinding, polishing, washing automatic machine - Google Patents

One pass type multi-head plane grinding, polishing, washing automatic machine

Info

Publication number
JPS57132965A
JPS57132965A JP56013845A JP1384581A JPS57132965A JP S57132965 A JPS57132965 A JP S57132965A JP 56013845 A JP56013845 A JP 56013845A JP 1384581 A JP1384581 A JP 1384581A JP S57132965 A JPS57132965 A JP S57132965A
Authority
JP
Japan
Prior art keywords
polishing
unit
grinding
plane grinding
works
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56013845A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243832B2 (enrdf_load_stackoverflow
Inventor
Koichi Hatano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibayama Kikai Co Ltd
Original Assignee
Shibayama Kikai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibayama Kikai Co Ltd filed Critical Shibayama Kikai Co Ltd
Priority to JP56013845A priority Critical patent/JPS57132965A/ja
Publication of JPS57132965A publication Critical patent/JPS57132965A/ja
Publication of JPS6243832B2 publication Critical patent/JPS6243832B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56013845A 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine Granted JPS57132965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56013845A JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56013845A JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Publications (2)

Publication Number Publication Date
JPS57132965A true JPS57132965A (en) 1982-08-17
JPS6243832B2 JPS6243832B2 (enrdf_load_stackoverflow) 1987-09-17

Family

ID=11844605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56013845A Granted JPS57132965A (en) 1981-02-03 1981-02-03 One pass type multi-head plane grinding, polishing, washing automatic machine

Country Status (1)

Country Link
JP (1) JPS57132965A (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン
JPS591156A (ja) * 1982-06-28 1984-01-06 Tohoku Metal Ind Ltd 自動ラツプ盤
JPS5919671A (ja) * 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd ポリツシング装置
JPS60119726A (ja) * 1983-11-30 1985-06-27 M Setetsuku Kk ウエファの加工装置
JPS61257749A (ja) * 1985-05-08 1986-11-15 Shibayama Kikai Kk 半導体ウエハの自動平面研削盤における揺動スピンドル軸
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
US6283822B1 (en) 1995-08-21 2001-09-04 Ebara Corporation Polishing apparatus
KR100905094B1 (ko) 2007-08-01 2009-06-30 주식회사 에스에프에이 웨이퍼 연마장치
KR100918069B1 (ko) 2007-08-01 2009-09-22 주식회사 에스에프에이 웨이퍼 연마장치
KR20170084704A (ko) * 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 연삭·연마 복합가공장치 및 연마장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5542738A (en) * 1978-09-20 1980-03-26 Toshiba Corp Abrasive grain processing device

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン
JPS591156A (ja) * 1982-06-28 1984-01-06 Tohoku Metal Ind Ltd 自動ラツプ盤
JPS5919671A (ja) * 1982-07-22 1984-02-01 Disco Abrasive Sys Ltd ポリツシング装置
JPS60119726A (ja) * 1983-11-30 1985-06-27 M Setetsuku Kk ウエファの加工装置
JPS61257749A (ja) * 1985-05-08 1986-11-15 Shibayama Kikai Kk 半導体ウエハの自動平面研削盤における揺動スピンドル軸
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
US6283822B1 (en) 1995-08-21 2001-09-04 Ebara Corporation Polishing apparatus
US6942541B2 (en) 1995-08-21 2005-09-13 Ebara Corporation Polishing apparatus
KR100905094B1 (ko) 2007-08-01 2009-06-30 주식회사 에스에프에이 웨이퍼 연마장치
KR100918069B1 (ko) 2007-08-01 2009-09-22 주식회사 에스에프에이 웨이퍼 연마장치
KR20170084704A (ko) * 2016-01-12 2017-07-20 나카무라 토메 세이미쓰고교 가부시키가이샤 연삭·연마 복합가공장치 및 연마장치

Also Published As

Publication number Publication date
JPS6243832B2 (enrdf_load_stackoverflow) 1987-09-17

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