JPS5694635A - Metal-mold device for sealing by resin - Google Patents

Metal-mold device for sealing by resin

Info

Publication number
JPS5694635A
JPS5694635A JP16929779A JP16929779A JPS5694635A JP S5694635 A JPS5694635 A JP S5694635A JP 16929779 A JP16929779 A JP 16929779A JP 16929779 A JP16929779 A JP 16929779A JP S5694635 A JPS5694635 A JP S5694635A
Authority
JP
Japan
Prior art keywords
resin
metal
sealing
runner
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16929779A
Other languages
English (en)
Inventor
Masashi Wakebe
Minoru Togashi
Toru Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16929779A priority Critical patent/JPS5694635A/ja
Publication of JPS5694635A publication Critical patent/JPS5694635A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP16929779A 1979-12-27 1979-12-27 Metal-mold device for sealing by resin Pending JPS5694635A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16929779A JPS5694635A (en) 1979-12-27 1979-12-27 Metal-mold device for sealing by resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16929779A JPS5694635A (en) 1979-12-27 1979-12-27 Metal-mold device for sealing by resin

Publications (1)

Publication Number Publication Date
JPS5694635A true JPS5694635A (en) 1981-07-31

Family

ID=15883899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16929779A Pending JPS5694635A (en) 1979-12-27 1979-12-27 Metal-mold device for sealing by resin

Country Status (1)

Country Link
JP (1) JPS5694635A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989424A (ja) * 1982-10-04 1984-05-23 テキサス・インスツルメンツ・インコ−ポレ−テツド 半導体装置のパツケ−ジング装置及び方法
DE3814257A1 (de) * 1987-04-27 1988-11-17 Hitachi Ltd Vorrichtung und verfahren zur erzeugung von halbleitereinrichtungen
JPH01205432A (ja) * 1987-04-27 1989-08-17 Hitachi Ltd 半導体素子製造装置及び製造方法
JPH01235340A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体樹脂封止装置
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法
JPH08335599A (ja) * 1996-07-22 1996-12-17 Hitachi Ltd 半導体装置の製造方法
JPH08335598A (ja) * 1996-07-22 1996-12-17 Hitachi Ltd 半導体装置の製造方法
WO2011046084A1 (ja) * 2009-10-15 2011-04-21 日亜化学工業株式会社 発光装置及びその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989424A (ja) * 1982-10-04 1984-05-23 テキサス・インスツルメンツ・インコ−ポレ−テツド 半導体装置のパツケ−ジング装置及び方法
DE3814257A1 (de) * 1987-04-27 1988-11-17 Hitachi Ltd Vorrichtung und verfahren zur erzeugung von halbleitereinrichtungen
JPH01205432A (ja) * 1987-04-27 1989-08-17 Hitachi Ltd 半導体素子製造装置及び製造方法
DE3814257C2 (de) * 1987-04-27 1996-06-20 Hitachi Ltd Gießform zum Herstellen von in Kunstharz eingekapselten Halbleiterelementen
JPH01235340A (ja) * 1988-03-16 1989-09-20 Hitachi Ltd 半導体樹脂封止装置
JPH0244739A (ja) * 1988-08-05 1990-02-14 Hitachi Ltd 樹脂封止パッケージの成形方法
JPH08335599A (ja) * 1996-07-22 1996-12-17 Hitachi Ltd 半導体装置の製造方法
JPH08335598A (ja) * 1996-07-22 1996-12-17 Hitachi Ltd 半導体装置の製造方法
WO2011046084A1 (ja) * 2009-10-15 2011-04-21 日亜化学工業株式会社 発光装置及びその製造方法
JP2011103437A (ja) * 2009-10-15 2011-05-26 Nichia Corp 発光装置及びその製造方法
US9705048B2 (en) 2009-10-15 2017-07-11 Nichia Corporation Light-emitting device and method for manufacturing same

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