JPS5644639A - Molding method and device for thermosetting synthetic resin - Google Patents

Molding method and device for thermosetting synthetic resin

Info

Publication number
JPS5644639A
JPS5644639A JP12177479A JP12177479A JPS5644639A JP S5644639 A JPS5644639 A JP S5644639A JP 12177479 A JP12177479 A JP 12177479A JP 12177479 A JP12177479 A JP 12177479A JP S5644639 A JPS5644639 A JP S5644639A
Authority
JP
Japan
Prior art keywords
runner
thermosetting synthetic
synthetic resin
cavity
pot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12177479A
Other languages
Japanese (ja)
Inventor
Michio Osada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOWA SEIMITSU KOGYO KK
Original Assignee
TOWA SEIMITSU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOWA SEIMITSU KOGYO KK filed Critical TOWA SEIMITSU KOGYO KK
Priority to JP12177479A priority Critical patent/JPS5644639A/en
Publication of JPS5644639A publication Critical patent/JPS5644639A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities

Abstract

PURPOSE:To raise the yeild of molding materials of thermosetting synthetic resins by molding them while keeping the temperatures of runner portion at a temperature below those of a pot portion, a curl portion, a cavity portion, etc. CONSTITUTION:The cavity 12' is formed of the molds 1 and 2 vertically provided and a thermosetting synthetic resin supplied into the pot 16 is injected into the cavity 12' through the main runner 27 and auxiliary runner to form a desired thermosetting synthetic resin molding. In such a mold device, the flow path 17 for a coolant fluid is provided in the circumferetial area of the main runner 27 and the auxiliary runner 24' in order to keep the temperatures of the main runner 27 and the auxiliary runner 24' at a temperature below those of the pot portion 16, the curl portion 26, the cavity portion 12', etc.
JP12177479A 1979-09-20 1979-09-20 Molding method and device for thermosetting synthetic resin Pending JPS5644639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12177479A JPS5644639A (en) 1979-09-20 1979-09-20 Molding method and device for thermosetting synthetic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12177479A JPS5644639A (en) 1979-09-20 1979-09-20 Molding method and device for thermosetting synthetic resin

Publications (1)

Publication Number Publication Date
JPS5644639A true JPS5644639A (en) 1981-04-23

Family

ID=14819547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12177479A Pending JPS5644639A (en) 1979-09-20 1979-09-20 Molding method and device for thermosetting synthetic resin

Country Status (1)

Country Link
JP (1) JPS5644639A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139931A (en) * 1981-02-24 1982-08-30 Mitsubishi Electric Corp Resin-sealing mold for semiconductor device
JPS6120718A (en) * 1984-07-06 1986-01-29 アドヴアンスド　セミコンダクタ−　マテイリアルズ　フイコ　ツ−リング　ベスロ−テン　フエンノ−トチヤツプ Transfer molding equipment with low-temperature runner and method thereof
JPS62210629A (en) * 1986-03-11 1987-09-16 Fujitsu Ltd Metal mold for resin sealing and resin sealing method using the same
JP2016187880A (en) * 2015-03-30 2016-11-04 日本電産サンキョー株式会社 Metallic mold for injection molding and injection molding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139931A (en) * 1981-02-24 1982-08-30 Mitsubishi Electric Corp Resin-sealing mold for semiconductor device
JPS6120718A (en) * 1984-07-06 1986-01-29 アドヴアンスド　セミコンダクタ−　マテイリアルズ　フイコ　ツ−リング　ベスロ−テン　フエンノ−トチヤツプ Transfer molding equipment with low-temperature runner and method thereof
JPS6315892B2 (en) * 1984-07-06 1988-04-06 Adobansudo Semikondakutaa Mateiriaruzu Fuiko Tsuuringu Bv
JPS62210629A (en) * 1986-03-11 1987-09-16 Fujitsu Ltd Metal mold for resin sealing and resin sealing method using the same
JP2016187880A (en) * 2015-03-30 2016-11-04 日本電産サンキョー株式会社 Metallic mold for injection molding and injection molding method

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