JPS5650573A - Mis tunnel diode type mosfet - Google Patents

Mis tunnel diode type mosfet

Info

Publication number
JPS5650573A
JPS5650573A JP12641579A JP12641579A JPS5650573A JP S5650573 A JPS5650573 A JP S5650573A JP 12641579 A JP12641579 A JP 12641579A JP 12641579 A JP12641579 A JP 12641579A JP S5650573 A JPS5650573 A JP S5650573A
Authority
JP
Japan
Prior art keywords
forming
oxide film
substrate
thickness
tunnel diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12641579A
Other languages
Japanese (ja)
Inventor
Yujiro Naruse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12641579A priority Critical patent/JPS5650573A/en
Publication of JPS5650573A publication Critical patent/JPS5650573A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate

Abstract

PURPOSE:To contrive the facilitation of an MIS tunnel diode type MOSFET by not forming a diffused region on the surface of a substrate, forming once an insulating film thereon, selectively etching a part of the film so as not to repeat the step of forming an insulating film, and thereby freely selecting an electrode forming machine. CONSTITUTION:A silicon oxide film 2 is grown on a thickness of higher than 100Angstrom on the surface of an n type silicon substrate 1. The substrate 1 is thermally oxidized at a temperature higher than 1,000 deg.C in oxygen or oxygen and steam mixture atmosphere or is formed by a plasma oxidation process. Subsequently, the oxide film is selectively photoetched at predetermined portions 21, 22 adjacent to the source and drain electrodes 31 and 32 so as to have a thickness less than 100Angstrom . However, the predetermined oxide film 20 disposed directly under the gate 4 is retained in the thickness higher than 100Angstrom . Thereafter, gold is evaporated, the electrodes 31, 32 are evaporated with aluminum, and the gate 4 is selectively formed.
JP12641579A 1979-10-02 1979-10-02 Mis tunnel diode type mosfet Pending JPS5650573A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12641579A JPS5650573A (en) 1979-10-02 1979-10-02 Mis tunnel diode type mosfet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12641579A JPS5650573A (en) 1979-10-02 1979-10-02 Mis tunnel diode type mosfet

Publications (1)

Publication Number Publication Date
JPS5650573A true JPS5650573A (en) 1981-05-07

Family

ID=14934593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12641579A Pending JPS5650573A (en) 1979-10-02 1979-10-02 Mis tunnel diode type mosfet

Country Status (1)

Country Link
JP (1) JPS5650573A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130469A (en) * 1981-02-05 1982-08-12 Seiko Epson Corp Mis type semiconductor device
JPS63127220A (en) * 1986-11-17 1988-05-31 Fuji Photo Optical Co Ltd Electronic endoscope
JP2005333151A (en) * 2005-06-13 2005-12-02 Takashi Katoda Electronic device and optical device having ultrafine structure made through use of focused ion beam

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130469A (en) * 1981-02-05 1982-08-12 Seiko Epson Corp Mis type semiconductor device
JPS63127220A (en) * 1986-11-17 1988-05-31 Fuji Photo Optical Co Ltd Electronic endoscope
JP2005333151A (en) * 2005-06-13 2005-12-02 Takashi Katoda Electronic device and optical device having ultrafine structure made through use of focused ion beam

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