JPS5650524A - Attaching method for semiconductor element - Google Patents

Attaching method for semiconductor element

Info

Publication number
JPS5650524A
JPS5650524A JP12760579A JP12760579A JPS5650524A JP S5650524 A JPS5650524 A JP S5650524A JP 12760579 A JP12760579 A JP 12760579A JP 12760579 A JP12760579 A JP 12760579A JP S5650524 A JPS5650524 A JP S5650524A
Authority
JP
Japan
Prior art keywords
substrate
solder
semiconductor element
supplying section
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12760579A
Other languages
Japanese (ja)
Inventor
Shoichi Koreeda
Akio Takabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12760579A priority Critical patent/JPS5650524A/en
Publication of JPS5650524A publication Critical patent/JPS5650524A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To prevent oxidation of the surface of solder and a substrate by a method wherein the substrate on which a semiconductor element is attached is heated, a fixed quantity of fused solder is dripped and the semiconductor element is attached to the substrate with the fused solder. CONSTITUTION:At the same time when a substrate 8 is moved to leftwards, a solder supplying section 11 is shifted to a desired position. And solder is dripped from the solder supplying section 11 on the substrate 8 being heated by a heating section 9 and then the substrate is returned to its former position. Subsequently, an element supplying section 12 is shifted to the same desired position as above, the element is adhered on the dripped molten solder and the element supplying section 12 returns to its former position. These movements are repeatedly performed. Hereby, as an oxide film is hard to grow on the semiconductor surface, the wetting property of solder to the semiconductor element is improved, and radiation effect from the semiconductor element can be increased. Also, as the substrate is heated for a relatively short time, the plated surface of the substrate is not oxidated and an excellent soldering can be performed.
JP12760579A 1979-10-02 1979-10-02 Attaching method for semiconductor element Pending JPS5650524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12760579A JPS5650524A (en) 1979-10-02 1979-10-02 Attaching method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12760579A JPS5650524A (en) 1979-10-02 1979-10-02 Attaching method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS5650524A true JPS5650524A (en) 1981-05-07

Family

ID=14964213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12760579A Pending JPS5650524A (en) 1979-10-02 1979-10-02 Attaching method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS5650524A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
US4912740A (en) * 1988-08-19 1990-03-27 Eastman Kodak Company Intraoral dental radiographic film packet improvement
US4911871A (en) * 1988-08-19 1990-03-27 Eastman Kodak Company Method for effecting an intraoral dental radiographic film packet improvement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60177661A (en) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd Soldering method of semiconductor
US4912740A (en) * 1988-08-19 1990-03-27 Eastman Kodak Company Intraoral dental radiographic film packet improvement
US4911871A (en) * 1988-08-19 1990-03-27 Eastman Kodak Company Method for effecting an intraoral dental radiographic film packet improvement

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