JPS5419361A - Forming method of electrodes for semiconductor devices - Google Patents

Forming method of electrodes for semiconductor devices

Info

Publication number
JPS5419361A
JPS5419361A JP8455677A JP8455677A JPS5419361A JP S5419361 A JPS5419361 A JP S5419361A JP 8455677 A JP8455677 A JP 8455677A JP 8455677 A JP8455677 A JP 8455677A JP S5419361 A JPS5419361 A JP S5419361A
Authority
JP
Japan
Prior art keywords
electrodes
semiconductor devices
forming method
melting point
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8455677A
Other languages
Japanese (ja)
Other versions
JPS5758781B2 (en
Inventor
Tadamitsu Ogawa
Akihiro Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8455677A priority Critical patent/JPS5419361A/en
Publication of JPS5419361A publication Critical patent/JPS5419361A/en
Publication of JPS5758781B2 publication Critical patent/JPS5758781B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
    • H01L2224/10122—Auxiliary members for bump connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
    • H01L2224/10125—Reinforcing structures
    • H01L2224/10126—Bump collar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]

Abstract

PURPOSE: To selectively form low melting point metal layers only on electrode metals by making ingenious use of the goodness or not of wetting of a low melting point metal to Si substrates and electrode metals making ohmic contact therewith.
COPYRIGHT: (C)1979,JPO&Japio
JP8455677A 1977-07-13 1977-07-13 Forming method of electrodes for semiconductor devices Granted JPS5419361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8455677A JPS5419361A (en) 1977-07-13 1977-07-13 Forming method of electrodes for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8455677A JPS5419361A (en) 1977-07-13 1977-07-13 Forming method of electrodes for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5419361A true JPS5419361A (en) 1979-02-14
JPS5758781B2 JPS5758781B2 (en) 1982-12-11

Family

ID=13833908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8455677A Granted JPS5419361A (en) 1977-07-13 1977-07-13 Forming method of electrodes for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5419361A (en)

Also Published As

Publication number Publication date
JPS5758781B2 (en) 1982-12-11

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