JPS547887A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS547887A
JPS547887A JP7355577A JP7355577A JPS547887A JP S547887 A JPS547887 A JP S547887A JP 7355577 A JP7355577 A JP 7355577A JP 7355577 A JP7355577 A JP 7355577A JP S547887 A JPS547887 A JP S547887A
Authority
JP
Japan
Prior art keywords
semiconductor device
copper
etchingfrom
sio
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7355577A
Other languages
Japanese (ja)
Inventor
Toshiyuki Fujii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7355577A priority Critical patent/JPS547887A/en
Publication of JPS547887A publication Critical patent/JPS547887A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To prevent the etchingfrom copper to Si, by making coat process for the Si exposure with SiO2, Si3N4 or low melting point glass, when fixing electrode metal material including copper on the Si pellet surface.
COPYRIGHT: (C)1979,JPO&Japio
JP7355577A 1977-06-20 1977-06-20 Semiconductor device Pending JPS547887A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7355577A JPS547887A (en) 1977-06-20 1977-06-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7355577A JPS547887A (en) 1977-06-20 1977-06-20 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS547887A true JPS547887A (en) 1979-01-20

Family

ID=13521596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7355577A Pending JPS547887A (en) 1977-06-20 1977-06-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS547887A (en)

Similar Documents

Publication Publication Date Title
JPS5425178A (en) Manufacture for semiconductor device
JPS5395571A (en) Semiconductor device
JPS5220782A (en) Semi-conductor element mounting method
JPS547887A (en) Semiconductor device
JPS5422163A (en) Semiconductor device
JPS53105366A (en) Manufacture for semiconductor element substrate
JPS542069A (en) Semiconductor device
JPS5436182A (en) Manufacture for semiconductor device
JPS5227390A (en) Electrode wiring formation system of semiconductor device
JPS5245270A (en) Semiconductor device
JPS52141565A (en) Manufacture of semiconductor unit
JPS5380163A (en) Manufacture of semiconductor device
JPS547867A (en) Manufacture for semiconductor device
JPS52124861A (en) Semiconductor element
JPS5379461A (en) Semiconductor device and its manufacturing process
JPS5389669A (en) Production of semiconductor device
JPS53118990A (en) Manufacture for resistor
JPS51130618A (en) Abration-resistant 2-layered pipe with good weldability
JPS51138166A (en) Production method of semiconductor device
JPS547879A (en) Manufacture for semiconductor device
JPS522171A (en) Electronic parts
JPS53141488A (en) Position fixing method of core of flat cable
JPS52155972A (en) Production of semiconductor device
JPS53114674A (en) Manufacture for compound semiconductor device
JPS5432067A (en) Semiconductor device and its manufacture