JPS5772354A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS5772354A
JPS5772354A JP14899080A JP14899080A JPS5772354A JP S5772354 A JPS5772354 A JP S5772354A JP 14899080 A JP14899080 A JP 14899080A JP 14899080 A JP14899080 A JP 14899080A JP S5772354 A JPS5772354 A JP S5772354A
Authority
JP
Japan
Prior art keywords
cap
mount
package
nearly
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14899080A
Other languages
Japanese (ja)
Inventor
Hidehiko Akasaki
Mamoru Yanagisawa
Takehisa Tsujimura
Tomio Oda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14899080A priority Critical patent/JPS5772354A/en
Publication of JPS5772354A publication Critical patent/JPS5772354A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To make is possible to easily weld a cap and a mount of a package at a relatively-low temperature by adhering a metal layer made by implanting an element for lowering its melting point into Ni as a metal layer for welding to the cap and mount. CONSTITUTION:Welding parts A and B of a package mount 2 and a cap 5 are immersed into an electroless plating solution including NiCl2NaPH2O1 and C2H3O3Na at the temperature of nearly 90 deg.C for 30min, thereby constituting an electroless Ni plating layer including P by nearly 10% on the welding parts of cap 5 and mount 2. Thus, the melting point of Ni implating P decreases down to nearly 880 deg.C.
JP14899080A 1980-10-24 1980-10-24 Package for semiconductor device Pending JPS5772354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14899080A JPS5772354A (en) 1980-10-24 1980-10-24 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14899080A JPS5772354A (en) 1980-10-24 1980-10-24 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5772354A true JPS5772354A (en) 1982-05-06

Family

ID=15465228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14899080A Pending JPS5772354A (en) 1980-10-24 1980-10-24 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5772354A (en)

Similar Documents

Publication Publication Date Title
JPS5772354A (en) Package for semiconductor device
JPS5389368A (en) Production of semiconductor integrated circuit
JPS5422162A (en) Manufacture of semiconductor device
JPS5322365A (en) Resin mold type semiconductor device and its production
JPS5390868A (en) Semiconductor device of glass ceramic package type
JPS53144671A (en) Production of semiconductor device
JPS5793535A (en) Semiconductor device
JPS57192057A (en) Semiconductor device
JPS5797213A (en) Supporting method of quartz oscillator
JPS51138183A (en) Glass sealed solar battery device
JPS5656645A (en) Assembling method for semiconductor device
JPS52129280A (en) Wire bonding method
JPS52132778A (en) Manufacture for semiconductor device
JPS5437574A (en) Fabrication method of semiconductor pellet
JPS52144272A (en) Forming method of electrode in semiconductor device
JPS5314562A (en) Mounting method of semiconductor pellet to lead frame
JPS5349949A (en) Pellet bonding method
JPS5324781A (en) Semiconductor device
JPS54133449A (en) Solder for aluminum and aluminum alloy
JPS5413774A (en) Production of semiconductor devices
JPS5359365A (en) Semiconductor unit
JPS5567146A (en) Method for manufacturing semiconductor device
JPS53138274A (en) Manufacture for semiconductor parts
JPS53125770A (en) Mounting method of semiconductor element to heat sink
JPS5435847A (en) Fixing method for metal foil