JPS53125770A - Mounting method of semiconductor element to heat sink - Google Patents

Mounting method of semiconductor element to heat sink

Info

Publication number
JPS53125770A
JPS53125770A JP4052477A JP4052477A JPS53125770A JP S53125770 A JPS53125770 A JP S53125770A JP 4052477 A JP4052477 A JP 4052477A JP 4052477 A JP4052477 A JP 4052477A JP S53125770 A JPS53125770 A JP S53125770A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor element
mounting method
adhere
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4052477A
Other languages
Japanese (ja)
Inventor
Kunihiko Washio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4052477A priority Critical patent/JPS53125770A/en
Publication of JPS53125770A publication Critical patent/JPS53125770A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To press-adhere a element by heating and melting a metal of low melting point on a heat sink with laser light.
COPYRIGHT: (C)1978,JPO&Japio
JP4052477A 1977-04-08 1977-04-08 Mounting method of semiconductor element to heat sink Pending JPS53125770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4052477A JPS53125770A (en) 1977-04-08 1977-04-08 Mounting method of semiconductor element to heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4052477A JPS53125770A (en) 1977-04-08 1977-04-08 Mounting method of semiconductor element to heat sink

Publications (1)

Publication Number Publication Date
JPS53125770A true JPS53125770A (en) 1978-11-02

Family

ID=12582877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4052477A Pending JPS53125770A (en) 1977-04-08 1977-04-08 Mounting method of semiconductor element to heat sink

Country Status (1)

Country Link
JP (1) JPS53125770A (en)

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