JPS5642356A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5642356A
JPS5642356A JP11707379A JP11707379A JPS5642356A JP S5642356 A JPS5642356 A JP S5642356A JP 11707379 A JP11707379 A JP 11707379A JP 11707379 A JP11707379 A JP 11707379A JP S5642356 A JPS5642356 A JP S5642356A
Authority
JP
Japan
Prior art keywords
polysilicon
film
mask
si3n4
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11707379A
Other languages
English (en)
Other versions
JPS6138860B2 (ja
Inventor
Shiyouji Ariizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP11707379A priority Critical patent/JPS5642356A/ja
Publication of JPS5642356A publication Critical patent/JPS5642356A/ja
Publication of JPS6138860B2 publication Critical patent/JPS6138860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP11707379A 1979-09-12 1979-09-12 Manufacture of semiconductor device Granted JPS5642356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11707379A JPS5642356A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11707379A JPS5642356A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5642356A true JPS5642356A (en) 1981-04-20
JPS6138860B2 JPS6138860B2 (ja) 1986-09-01

Family

ID=14702733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11707379A Granted JPS5642356A (en) 1979-09-12 1979-09-12 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5642356A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121648A (ja) * 1982-01-13 1983-07-20 Fujitsu Ltd 多層配線形成方法
JPH027716B2 (ja) * 1984-07-13 1990-02-20 Hitachi Plant Eng & Constr Co

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640720B2 (ja) * 1986-08-01 1994-05-25 株式会社日立製作所 小型回転機
JPH0366559U (ja) * 1989-10-30 1991-06-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58121648A (ja) * 1982-01-13 1983-07-20 Fujitsu Ltd 多層配線形成方法
JPH027716B2 (ja) * 1984-07-13 1990-02-20 Hitachi Plant Eng & Constr Co

Also Published As

Publication number Publication date
JPS6138860B2 (ja) 1986-09-01

Similar Documents

Publication Publication Date Title
US4046606A (en) Simultaneous location of areas having different conductivities
JPS5642356A (en) Manufacture of semiconductor device
JPS5567141A (en) Method for manufacturing semiconductor device
JPS55156369A (en) Manufacture of semiconductor device
JPS5642355A (en) Manufacture of semiconductor device
JPS5513953A (en) Complementary integrated circuit
JPS57207374A (en) Manufacture of semiconductor device
JPS5527659A (en) Method of manufacturing semiconductor device
JPS57194572A (en) Semiconductor device and manufacture thereof
JPS5718362A (en) Semiconductor device and manufacture thereof
JPS5650577A (en) Manufacture of semiconductor device
JPS5679446A (en) Production of semiconductor device
JPS5724547A (en) Manufacture of semiconductor element
JPS5562750A (en) Semiconductor integrated circuit device
JPS56148868A (en) Manufacture of semiconductor device
JPS55160445A (en) Manufacture of semiconductor device
KR970003937A (ko) 금속 산화물 실리콘 전계 효과 트랜지스터의 제조방법
JPS5745924A (en) Manufacture of semiconductor device
KR940016589A (ko) 필드산화막 제조방법
JPS55130146A (en) Semiconductor integrated circuit and fabricating method of the same
JPS5521159A (en) Manufacturing method for mutual compensated type semiconductor device
JPS56148841A (en) Manufacture of semiconductor device
JPS5763859A (en) Preparation of semiconductor device
JPS5691476A (en) Semiconductor
JPS5779644A (en) Manufacture of semiconductor device