JPS5637649A - Manufacturing of semiconductor device - Google Patents

Manufacturing of semiconductor device

Info

Publication number
JPS5637649A
JPS5637649A JP11340079A JP11340079A JPS5637649A JP S5637649 A JPS5637649 A JP S5637649A JP 11340079 A JP11340079 A JP 11340079A JP 11340079 A JP11340079 A JP 11340079A JP S5637649 A JPS5637649 A JP S5637649A
Authority
JP
Japan
Prior art keywords
film
plasma
etched
al2o3
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11340079A
Other languages
Japanese (ja)
Inventor
Teruhiko Yamazaki
Jun Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP11340079A priority Critical patent/JPS5637649A/en
Publication of JPS5637649A publication Critical patent/JPS5637649A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain the Al wirings with uniform pattern width on an insulative film by method wherein Al2O3 on the surface of an Al film laid upon the insulative film is selectively etched by using reducing gas plasma and then the Al film is etched by using gas plasma of compounds containing Cl2. CONSTITUTION:When an Al film 5 is evaporated on an insulative film 3 having an opening above an active layer in a semiconductor substrate, an Al2O3 film 6 is formed thereon naturally. After applying a mask 7, the Al2O3 film 6 is etched in plasma of CO gas. Then, the Al film 5 is etched in plasma of CCl4 and the mask 7 is removed by using plasma of O2 gas. According to this method, the Al film can be etched with no influence from its thickness when etching Al2O3 by CC4. Thus, the etching time by plasma becomes more uniform and the variation in pattern width of the Al wirings formed on the insulative film is reduced.
JP11340079A 1979-09-03 1979-09-03 Manufacturing of semiconductor device Pending JPS5637649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11340079A JPS5637649A (en) 1979-09-03 1979-09-03 Manufacturing of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11340079A JPS5637649A (en) 1979-09-03 1979-09-03 Manufacturing of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5637649A true JPS5637649A (en) 1981-04-11

Family

ID=14611329

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11340079A Pending JPS5637649A (en) 1979-09-03 1979-09-03 Manufacturing of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5637649A (en)

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