JPS5627929A - Electron beam projection - Google Patents
Electron beam projectionInfo
- Publication number
- JPS5627929A JPS5627929A JP10345479A JP10345479A JPS5627929A JP S5627929 A JPS5627929 A JP S5627929A JP 10345479 A JP10345479 A JP 10345479A JP 10345479 A JP10345479 A JP 10345479A JP S5627929 A JPS5627929 A JP S5627929A
- Authority
- JP
- Japan
- Prior art keywords
- electron beam
- photo resist
- mark
- positioning
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Abstract
PURPOSE:To attempt the enlargement of effective area of a semiconductor chip when a pattern is drawn directly by the electron beam projection on a positive photo resist layer of the semiconductor substrate by a method wherein after the pattern is drawn, the positive photo resist covering the positioning mark of chip is irradiated with a strong electron beam. CONSTITUTION:A concave part is provided in a chip region of a silicon IC substrate 5 to form a positioning mark 1, an SiO2 film 4 is formed on the surface and a positive photo resist layer 6 is adhered on it and the substrate is put in an electron beam projector. At first a positive mark 1 is scanned by an electron beam 7 to perform positioning, and a pattern 8 of an electrode contact opening is drawn. In succession the part of the positive photo resist near the positioning mark 1 is made to be projected strongly by a low speed scanning beam to convert it into a negative photo resist layer 10. By this way, the part of positioning mark does not deform when the etching to form the opening for the contact part 11 is performed, and as the same mark can be used for the positioning in the next process, the enlargement of effective area of chip can be attempted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10345479A JPS5627929A (en) | 1979-08-14 | 1979-08-14 | Electron beam projection |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10345479A JPS5627929A (en) | 1979-08-14 | 1979-08-14 | Electron beam projection |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5627929A true JPS5627929A (en) | 1981-03-18 |
JPS6148771B2 JPS6148771B2 (en) | 1986-10-25 |
Family
ID=14354464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10345479A Granted JPS5627929A (en) | 1979-08-14 | 1979-08-14 | Electron beam projection |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5627929A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5793133U (en) * | 1980-11-28 | 1982-06-08 | ||
JPS6066428A (en) * | 1983-09-21 | 1985-04-16 | Fujitsu Ltd | Electron beam exposing method |
JPS61168916A (en) * | 1985-01-22 | 1986-07-30 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH04101411A (en) * | 1990-08-20 | 1992-04-02 | Matsushita Electric Ind Co Ltd | Method of aligning electron-beam direct writing |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223404A (en) * | 1999-02-02 | 2000-08-11 | Nikon Corp | Method for detecting mark for alignment in charged particle beam exposure system |
-
1979
- 1979-08-14 JP JP10345479A patent/JPS5627929A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5793133U (en) * | 1980-11-28 | 1982-06-08 | ||
JPS6066428A (en) * | 1983-09-21 | 1985-04-16 | Fujitsu Ltd | Electron beam exposing method |
JPS61168916A (en) * | 1985-01-22 | 1986-07-30 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH04101411A (en) * | 1990-08-20 | 1992-04-02 | Matsushita Electric Ind Co Ltd | Method of aligning electron-beam direct writing |
Also Published As
Publication number | Publication date |
---|---|
JPS6148771B2 (en) | 1986-10-25 |
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