JPS5558569A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5558569A
JPS5558569A JP13138078A JP13138078A JPS5558569A JP S5558569 A JPS5558569 A JP S5558569A JP 13138078 A JP13138078 A JP 13138078A JP 13138078 A JP13138078 A JP 13138078A JP S5558569 A JPS5558569 A JP S5558569A
Authority
JP
Japan
Prior art keywords
contact hole
resist mask
ohmic
resist
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13138078A
Other languages
Japanese (ja)
Inventor
Yuji Kusano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13138078A priority Critical patent/JPS5558569A/en
Publication of JPS5558569A publication Critical patent/JPS5558569A/en
Pending legal-status Critical Current

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Landscapes

  • Bipolar Transistors (AREA)

Abstract

PURPOSE: To obtain a fine-pattern ohmic-contact hole, by etching and removing thin parts of an oxide film by using a resist mask, and retaining thick parts, and then opening the thick parts by laminating resist masks.
CONSTITUTION: Extremely thin resist mask 51 is provided on base plate 1, on which base 3, emitter 4 and SiO2 2 have been formed. Etching is stopped in the condition where thin parts (ohmic-contact hole) of film 2 are completely opened (71). After resist 51 is heat treated; by providing resist mask 52 again, the remaining part of film 2 is opened (61). Since the resist mask at this time is of two-layers, the appearance of pinholes due to eching is very small. The mask is removed, and electrodes 91, 92 are fitted. By this structure, the contact hole of the thin oxide film part is etched sideways and does not expand to the neighborhood of the base-emitter junction. As a result, a stabilized ohmic-contact hole is formed.
COPYRIGHT: (C)1980,JPO&Japio
JP13138078A 1978-10-24 1978-10-24 Manufacture of semiconductor device Pending JPS5558569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13138078A JPS5558569A (en) 1978-10-24 1978-10-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13138078A JPS5558569A (en) 1978-10-24 1978-10-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5558569A true JPS5558569A (en) 1980-05-01

Family

ID=15056587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13138078A Pending JPS5558569A (en) 1978-10-24 1978-10-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5558569A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793569A (en) * 1980-12-03 1982-06-10 Fujitsu Ltd Manufacture of semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940062A (en) * 1972-07-13 1974-04-15 Intersil Inc

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940062A (en) * 1972-07-13 1974-04-15 Intersil Inc

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5793569A (en) * 1980-12-03 1982-06-10 Fujitsu Ltd Manufacture of semiconductor device
JPH0230575B2 (en) * 1980-12-03 1990-07-06 Fujitsu Ltd

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