JPS56158467A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56158467A
JPS56158467A JP6431080A JP6431080A JPS56158467A JP S56158467 A JPS56158467 A JP S56158467A JP 6431080 A JP6431080 A JP 6431080A JP 6431080 A JP6431080 A JP 6431080A JP S56158467 A JPS56158467 A JP S56158467A
Authority
JP
Japan
Prior art keywords
contact region
elements
faced
generation
bonding pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6431080A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239820B2 (enExample
Inventor
Natsuo Tsubouchi
Haruhiko Abe
Hiroji Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6431080A priority Critical patent/JPS56158467A/ja
Publication of JPS56158467A publication Critical patent/JPS56158467A/ja
Publication of JPS6239820B2 publication Critical patent/JPS6239820B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP6431080A 1980-05-12 1980-05-12 Semiconductor device Granted JPS56158467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6431080A JPS56158467A (en) 1980-05-12 1980-05-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6431080A JPS56158467A (en) 1980-05-12 1980-05-12 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56158467A true JPS56158467A (en) 1981-12-07
JPS6239820B2 JPS6239820B2 (enExample) 1987-08-25

Family

ID=13254530

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6431080A Granted JPS56158467A (en) 1980-05-12 1980-05-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56158467A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988864A (ja) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US6208018B1 (en) 1997-05-29 2001-03-27 Micron Technology, Inc. Piggyback multiple dice assembly
US6682954B1 (en) 1996-05-29 2004-01-27 Micron Technology, Inc. Method for employing piggyback multiple die #3
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51102566A (en) * 1975-03-07 1976-09-10 Suwa Seikosha Kk Shusekikairo
JPS5339068A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Semiconductor device
JPS5365063A (en) * 1976-11-22 1978-06-10 Nec Corp Semiconductor device
JPS5552246A (en) * 1978-10-13 1980-04-16 Mitsubishi Electric Corp Semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5988864A (ja) * 1982-11-12 1984-05-22 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US6682954B1 (en) 1996-05-29 2004-01-27 Micron Technology, Inc. Method for employing piggyback multiple die #3
US6208018B1 (en) 1997-05-29 2001-03-27 Micron Technology, Inc. Piggyback multiple dice assembly
US6900528B2 (en) 2001-06-21 2005-05-31 Micron Technology, Inc. Stacked mass storage flash memory package
US7262506B2 (en) 2001-06-21 2007-08-28 Micron Technology, Inc. Stacked mass storage flash memory package
US7375419B2 (en) 2001-06-21 2008-05-20 Micron Technology, Inc. Stacked mass storage flash memory package
US7704794B2 (en) 2001-06-21 2010-04-27 Micron Technology, Inc. Method of forming a semiconductor device
US7998792B2 (en) 2001-06-21 2011-08-16 Round Rock Research, Llc Semiconductor device assemblies, electronic devices including the same and assembly methods
US7999378B2 (en) 2001-06-21 2011-08-16 Round Rock Research, Llc Semiconductor devices including semiconductor dice in laterally offset stacked arrangement
US8049342B2 (en) 2001-06-21 2011-11-01 Round Rock Research, Llc Semiconductor device and method of fabrication thereof

Also Published As

Publication number Publication date
JPS6239820B2 (enExample) 1987-08-25

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