JPS56133355A - Curable polyphenylene ether resin composition - Google Patents

Curable polyphenylene ether resin composition

Info

Publication number
JPS56133355A
JPS56133355A JP3713080A JP3713080A JPS56133355A JP S56133355 A JPS56133355 A JP S56133355A JP 3713080 A JP3713080 A JP 3713080A JP 3713080 A JP3713080 A JP 3713080A JP S56133355 A JPS56133355 A JP S56133355A
Authority
JP
Japan
Prior art keywords
polyphenylene ether
ether resin
resin composition
prepolymer
curable polyphenylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3713080A
Other languages
English (en)
Other versions
JPS6121491B2 (ja
Inventor
Akitoshi Sugio
Masanobu Sho
Masatsugu Matsunaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP3713080A priority Critical patent/JPS56133355A/ja
Priority to US06/246,314 priority patent/US4389516A/en
Priority to DE19813111403 priority patent/DE3111403A1/de
Publication of JPS56133355A publication Critical patent/JPS56133355A/ja
Publication of JPS6121491B2 publication Critical patent/JPS6121491B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP3713080A 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition Granted JPS56133355A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3713080A JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition
US06/246,314 US4389516A (en) 1980-03-24 1981-03-23 Curable polyphenylene ether resin composition
DE19813111403 DE3111403A1 (de) 1980-03-24 1981-03-23 Haertbare polyphenylenaetherharzmasse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3713080A JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition

Publications (2)

Publication Number Publication Date
JPS56133355A true JPS56133355A (en) 1981-10-19
JPS6121491B2 JPS6121491B2 (ja) 1986-05-27

Family

ID=12489025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3713080A Granted JPS56133355A (en) 1980-03-24 1980-03-24 Curable polyphenylene ether resin composition

Country Status (1)

Country Link
JP (1) JPS56133355A (ja)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
WO2007094359A1 (ja) 2006-02-17 2007-08-23 Hitachi Chemical Co., Ltd. セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2007302876A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2007302877A (ja) * 2006-04-14 2007-11-22 Hitachi Chem Co Ltd Ｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2008095061A (ja) * 2006-02-17 2008-04-24 Hitachi Chem Co Ltd セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2008133414A (ja) * 2006-10-24 2008-06-12 Hitachi Chem Co Ltd 新規なセミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
WO2008136373A1 (ja) 2007-04-26 2008-11-13 Hitachi Chemical Company, Ltd. セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP2009161725A (ja) * 2007-05-31 2009-07-23 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
US20140255711A1 (en) * 2013-03-07 2014-09-11 Taiwan Union Technology Corporation Resin composition and uses of the same
KR20160132122A (ko) 2014-04-04 2016-11-16 히타치가세이가부시끼가이샤 N-치환 말레이미드기를 갖는 폴리페닐렌에테르 유도체, 및 그것을 사용한 열경화성 수지 조성물, 수지 바니시, 프리프레그, 금속 피복 적층판 및 다층 프린트 배선판
US20180037736A1 (en) * 2015-03-04 2018-02-08 Shengyi Technology Co., Ltd. Resin composition and pre-preg and laminate using the composition
WO2018105071A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板
WO2018105070A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 樹脂ワニス、プリプレグ、積層板及びプリント配線板
KR20190131094A (ko) 2017-03-30 2019-11-25 히타치가세이가부시끼가이샤 프리프레그의 제조 방법, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
WO2021060046A1 (ja) * 2019-09-27 2021-04-01 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
US11286346B2 (en) 2015-01-13 2022-03-29 Showa Denko Materials Co., Ltd. Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354712Y2 (ja) * 1987-01-24 1991-12-03

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58164639A (ja) * 1982-03-25 1983-09-29 Mitsubishi Gas Chem Co Inc 硬化性の樹脂組成物
EP2407503A1 (en) 2006-02-17 2012-01-18 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same
WO2007094359A1 (ja) 2006-02-17 2007-08-23 Hitachi Chemical Co., Ltd. セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2008095061A (ja) * 2006-02-17 2008-04-24 Hitachi Chem Co Ltd セミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
KR101321235B1 (ko) * 2006-02-17 2013-10-25 히타치가세이가부시끼가이샤 세미 ｉｐｎ형 복합체의 열경화성 수지 조성물 및 이것을이용한 바니시, 프리프레그 및 금속장 적층판
EP2546287A1 (en) 2006-02-17 2013-01-16 Hitachi Chemical Co., Ltd. Thermosetting resin composition of semi-ipn composite, and varnish, prepreg and metal clad laminated board using the same
JP2007302876A (ja) * 2006-04-13 2007-11-22 Hitachi Chem Co Ltd セミｉｐｎ型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2007302877A (ja) * 2006-04-14 2007-11-22 Hitachi Chem Co Ltd Ｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP2008133414A (ja) * 2006-10-24 2008-06-12 Hitachi Chem Co Ltd 新規なセミｉｐｎ型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
WO2008136373A1 (ja) 2007-04-26 2008-11-13 Hitachi Chemical Company, Ltd. セミｉｐｎ型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
US8404769B2 (en) 2007-04-26 2013-03-26 Hitachi Chemical Company, Ltd. Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
JP2009161725A (ja) * 2007-05-31 2009-07-23 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物および硬化性フィルムならびにそれらの硬化物
US9062145B2 (en) 2007-05-31 2015-06-23 Mitsubishi Gas Chemical Company, Inc. Curable resin composition, curable film and their cured products
US20140255711A1 (en) * 2013-03-07 2014-09-11 Taiwan Union Technology Corporation Resin composition and uses of the same
US10793716B2 (en) * 2013-03-07 2020-10-06 Taiwan Union Technology Corporation Resin composition and uses of the same
KR20160132122A (ko) 2014-04-04 2016-11-16 히타치가세이가부시끼가이샤 N-치환 말레이미드기를 갖는 폴리페닐렌에테르 유도체, 및 그것을 사용한 열경화성 수지 조성물, 수지 바니시, 프리프레그, 금속 피복 적층판 및 다층 프린트 배선판
US9828466B2 (en) 2014-04-04 2017-11-28 Hitachi Chemical Company, Ltd Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
US11286346B2 (en) 2015-01-13 2022-03-29 Showa Denko Materials Co., Ltd. Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
US10858514B2 (en) * 2015-03-04 2020-12-08 Shengyi Technology Co., Ltd. Resin composition and pre-preg and laminate using the composition
US20180037736A1 (en) * 2015-03-04 2018-02-08 Shengyi Technology Co., Ltd. Resin composition and pre-preg and laminate using the composition
KR20180080208A (ko) 2016-12-07 2018-07-11 히타치가세이가부시끼가이샤 수지 바니시, 프리프레그, 적층판 및 프린트 배선판
KR20190099091A (ko) 2016-12-07 2019-08-23 히타치가세이가부시끼가이샤 수지 바니시, 프리프레그, 적층판 및 프린트 배선판
WO2018105070A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 樹脂ワニス、プリプレグ、積層板及びプリント配線板
US10940674B2 (en) 2016-12-07 2021-03-09 Showa Denko Materials Co., Ltd. Resin varnish, prepreg, laminate, and printed wiring board
US11136454B2 (en) 2016-12-07 2021-10-05 Showa Denko Materials Co., Ltd. Thermosetting resin composition and its production method, prepreg, laminate, and printed wiring board
WO2018105071A1 (ja) 2016-12-07 2018-06-14 日立化成株式会社 熱硬化性樹脂組成物及びその製造方法、プリプレグ、積層板並びにプリント配線板
KR20190131094A (ko) 2017-03-30 2019-11-25 히타치가세이가부시끼가이샤 프리프레그의 제조 방법, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지
WO2021060046A1 (ja) * 2019-09-27 2021-04-01 パナソニックＩｐマネジメント株式会社 樹脂組成物、並びに、それを用いたプリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板及び配線基板
CN114423821A (zh) * 2019-09-27 2022-04-29 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板

Also Published As

Publication number Publication date
JPS6121491B2 (ja) 1986-05-27

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