JPS557824A - Adhesive for printed circuit board - Google Patents

Adhesive for printed circuit board

Info

Publication number
JPS557824A
JPS557824A JP7924878A JP7924878A JPS557824A JP S557824 A JPS557824 A JP S557824A JP 7924878 A JP7924878 A JP 7924878A JP 7924878 A JP7924878 A JP 7924878A JP S557824 A JPS557824 A JP S557824A
Authority
JP
Japan
Prior art keywords
adhesive
butadiene polymer
circuit board
printed circuit
essential component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7924878A
Other languages
Japanese (ja)
Inventor
Satoshi Kobayashi
Keikichi Yanagii
Mitsuru Tashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
Japan Synthetic Rubber Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Synthetic Rubber Co Ltd filed Critical Japan Synthetic Rubber Co Ltd
Priority to JP7924878A priority Critical patent/JPS557824A/en
Publication of JPS557824A publication Critical patent/JPS557824A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The title adhesive having low water absorption, excellent soldering resistance, electrical properties, etc., suitable for the adhesion of an electrical conductive material such as copper foil, etc. to a plastic insulating substate, and containing a cyclized butadiene polymer as an essential component.
CONSTITUTION: An adhesive composition comprising (A) a cyclized butadiene polymer as an essential component, and if necessary, (B) an organic solvent such as toluene, etc., (C) a curing catalyst such as cyclohexanone peroxide, etc., (D) a polymerizable monomer such as styrene, etc. The molecular weight of the butadiene polymer of the (A) component is pref. 2,000W1,000,000.
COPYRIGHT: (C)1980,JPO&Japio
JP7924878A 1978-07-01 1978-07-01 Adhesive for printed circuit board Pending JPS557824A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7924878A JPS557824A (en) 1978-07-01 1978-07-01 Adhesive for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7924878A JPS557824A (en) 1978-07-01 1978-07-01 Adhesive for printed circuit board

Publications (1)

Publication Number Publication Date
JPS557824A true JPS557824A (en) 1980-01-21

Family

ID=13684548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7924878A Pending JPS557824A (en) 1978-07-01 1978-07-01 Adhesive for printed circuit board

Country Status (1)

Country Link
JP (1) JPS557824A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1084338C (en) * 1997-06-27 2002-05-08 中国科学院长春应用化学研究所 Method for preparing soluble cyclopolymerized diolefin by rare earth catalytic synthesis reaction

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1084338C (en) * 1997-06-27 2002-05-08 中国科学院长春应用化学研究所 Method for preparing soluble cyclopolymerized diolefin by rare earth catalytic synthesis reaction

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