JPS557824A - Adhesive for printed circuit board - Google Patents
Adhesive for printed circuit boardInfo
- Publication number
- JPS557824A JPS557824A JP7924878A JP7924878A JPS557824A JP S557824 A JPS557824 A JP S557824A JP 7924878 A JP7924878 A JP 7924878A JP 7924878 A JP7924878 A JP 7924878A JP S557824 A JPS557824 A JP S557824A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- butadiene polymer
- circuit board
- printed circuit
- essential component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: The title adhesive having low water absorption, excellent soldering resistance, electrical properties, etc., suitable for the adhesion of an electrical conductive material such as copper foil, etc. to a plastic insulating substate, and containing a cyclized butadiene polymer as an essential component.
CONSTITUTION: An adhesive composition comprising (A) a cyclized butadiene polymer as an essential component, and if necessary, (B) an organic solvent such as toluene, etc., (C) a curing catalyst such as cyclohexanone peroxide, etc., (D) a polymerizable monomer such as styrene, etc. The molecular weight of the butadiene polymer of the (A) component is pref. 2,000W1,000,000.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7924878A JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7924878A JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS557824A true JPS557824A (en) | 1980-01-21 |
Family
ID=13684548
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7924878A Pending JPS557824A (en) | 1978-07-01 | 1978-07-01 | Adhesive for printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS557824A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1084338C (en) * | 1997-06-27 | 2002-05-08 | 中国科学院长春应用化学研究所 | Method for preparing soluble cyclopolymerized diolefin by rare earth catalytic synthesis reaction |
-
1978
- 1978-07-01 JP JP7924878A patent/JPS557824A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1084338C (en) * | 1997-06-27 | 2002-05-08 | 中国科学院长春应用化学研究所 | Method for preparing soluble cyclopolymerized diolefin by rare earth catalytic synthesis reaction |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5324347A (en) | Curable polybutadiene composition | |
JPS56133355A (en) | Curable polyphenylene ether resin composition | |
JPS557824A (en) | Adhesive for printed circuit board | |
JPS52132099A (en) | Thermosetting resin compositions | |
JPS5464599A (en) | Epoxy resin comosition | |
JPS56151757A (en) | Polyimide resin molded article | |
JPS5318661A (en) | Thermoplastic resin composition | |
JPS547441A (en) | Adhesive composition | |
JPS5466966A (en) | Manufacture of composite sheet | |
JPS55123626A (en) | Production of copper-plated laminate | |
JPS51131541A (en) | Coating compound suitable for electrical insulation | |
JPS5235292A (en) | Process for producing laminated boards | |
JPS5391961A (en) | Resin composition | |
JPS5437186A (en) | Thermosetting resin composition | |
EP0255050A3 (en) | Rubber or plastic insulated power cable | |
JPS57192415A (en) | Improvement of solvent resistance of thermoplastic resin | |
JPS52129733A (en) | Room temperature curing coating compositions with a high solid content | |
JPS5534250A (en) | Adhesive composition | |
JPS53144958A (en) | Epoxy resin composition | |
JPS5536224A (en) | Laminate | |
JPS52135385A (en) | Improved laminates | |
JPS54162734A (en) | Photopolymerizable resin composition for coating hybrid integrated circuit | |
JPS5757693A (en) | Conductive film | |
JPS53121825A (en) | Quick-curing varnishes | |
JPS5580427A (en) | Polymerization of cyclic fluorohydrocarbon compound |