JPS56130969A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56130969A
JPS56130969A JP3334580A JP3334580A JPS56130969A JP S56130969 A JPS56130969 A JP S56130969A JP 3334580 A JP3334580 A JP 3334580A JP 3334580 A JP3334580 A JP 3334580A JP S56130969 A JPS56130969 A JP S56130969A
Authority
JP
Japan
Prior art keywords
gate
gate electrode
electrode plate
plate
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3334580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6154262B2 (enrdf_load_stackoverflow
Inventor
Tsutomu Yao
Masami Naito
Takahiro Nagano
Tomiro Yasuda
Hitoshi Onuki
Mitsuo Yanagi
Fumio Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3334580A priority Critical patent/JPS56130969A/ja
Publication of JPS56130969A publication Critical patent/JPS56130969A/ja
Publication of JPS6154262B2 publication Critical patent/JPS6154262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thyristors (AREA)
JP3334580A 1980-03-18 1980-03-18 Semiconductor device Granted JPS56130969A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3334580A JPS56130969A (en) 1980-03-18 1980-03-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3334580A JPS56130969A (en) 1980-03-18 1980-03-18 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP11981080A Division JPS56131955A (en) 1980-09-01 1980-09-01 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56130969A true JPS56130969A (en) 1981-10-14
JPS6154262B2 JPS6154262B2 (enrdf_load_stackoverflow) 1986-11-21

Family

ID=12383971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3334580A Granted JPS56130969A (en) 1980-03-18 1980-03-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56130969A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58148433A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置
JPS5986260A (ja) * 1982-11-10 1984-05-18 Hitachi Ltd ゲ−トタ−ンオフサイリスタ
JPS60194565A (ja) * 1984-03-15 1985-10-03 Mitsubishi Electric Corp 半導体装置
JPS61208873A (ja) * 1985-03-13 1986-09-17 Res Dev Corp Of Japan 圧接構造型両面ゲ−ト静電誘導サイリスタ
JPS6276636A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 半導体装置
JPS6279668A (ja) * 1985-10-02 1987-04-13 Hitachi Ltd 平形半導体装置
JPH0382080A (ja) * 1989-08-24 1991-04-08 Mitsubishi Electric Corp バイポーラ型半導体スィッチング装置
DE102004006989B4 (de) * 2003-02-12 2012-11-08 Mitsubishi Denki K.K. Halbleitervorrichtung in Druckkontaktbauweise

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58148433A (ja) * 1982-02-26 1983-09-03 Mitsubishi Electric Corp 半導体装置
JPS5986260A (ja) * 1982-11-10 1984-05-18 Hitachi Ltd ゲ−トタ−ンオフサイリスタ
JPS60194565A (ja) * 1984-03-15 1985-10-03 Mitsubishi Electric Corp 半導体装置
JPS61208873A (ja) * 1985-03-13 1986-09-17 Res Dev Corp Of Japan 圧接構造型両面ゲ−ト静電誘導サイリスタ
JPS6276636A (ja) * 1985-09-30 1987-04-08 Toshiba Corp 半導体装置
JPS6279668A (ja) * 1985-10-02 1987-04-13 Hitachi Ltd 平形半導体装置
JPH0382080A (ja) * 1989-08-24 1991-04-08 Mitsubishi Electric Corp バイポーラ型半導体スィッチング装置
DE102004006989B4 (de) * 2003-02-12 2012-11-08 Mitsubishi Denki K.K. Halbleitervorrichtung in Druckkontaktbauweise

Also Published As

Publication number Publication date
JPS6154262B2 (enrdf_load_stackoverflow) 1986-11-21

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