JPS56126944A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS56126944A
JPS56126944A JP3126180A JP3126180A JPS56126944A JP S56126944 A JPS56126944 A JP S56126944A JP 3126180 A JP3126180 A JP 3126180A JP 3126180 A JP3126180 A JP 3126180A JP S56126944 A JPS56126944 A JP S56126944A
Authority
JP
Japan
Prior art keywords
layer
wiring
resin
wiring layer
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3126180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6322067B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Tokunaga
Ryoji Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3126180A priority Critical patent/JPS56126944A/ja
Publication of JPS56126944A publication Critical patent/JPS56126944A/ja
Publication of JPS6322067B2 publication Critical patent/JPS6322067B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP3126180A 1980-03-12 1980-03-12 Production of semiconductor device Granted JPS56126944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3126180A JPS56126944A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3126180A JPS56126944A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS56126944A true JPS56126944A (en) 1981-10-05
JPS6322067B2 JPS6322067B2 (enrdf_load_stackoverflow) 1988-05-10

Family

ID=12326398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3126180A Granted JPS56126944A (en) 1980-03-12 1980-03-12 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS56126944A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0644031U (ja) * 1992-11-12 1994-06-10 株式会社エンパイヤ 電線速結端子

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270780A (en) * 1975-12-10 1977-06-13 Toshiba Corp Manufacture of semiconductor device
JPS53123683A (en) * 1977-04-05 1978-10-28 Fujitsu Ltd Manufacture of wiring substrate
JPS54156488A (en) * 1978-05-31 1979-12-10 Hitachi Ltd Manufacture for semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270780A (en) * 1975-12-10 1977-06-13 Toshiba Corp Manufacture of semiconductor device
JPS53123683A (en) * 1977-04-05 1978-10-28 Fujitsu Ltd Manufacture of wiring substrate
JPS54156488A (en) * 1978-05-31 1979-12-10 Hitachi Ltd Manufacture for semiconductor device

Also Published As

Publication number Publication date
JPS6322067B2 (enrdf_load_stackoverflow) 1988-05-10

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