JPS53123683A - Manufacture of wiring substrate - Google Patents

Manufacture of wiring substrate

Info

Publication number
JPS53123683A
JPS53123683A JP3871777A JP3871777A JPS53123683A JP S53123683 A JPS53123683 A JP S53123683A JP 3871777 A JP3871777 A JP 3871777A JP 3871777 A JP3871777 A JP 3871777A JP S53123683 A JPS53123683 A JP S53123683A
Authority
JP
Japan
Prior art keywords
manufacture
wiring substrate
unevenness
burying
short
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3871777A
Other languages
Japanese (ja)
Inventor
Michio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3871777A priority Critical patent/JPS53123683A/en
Publication of JPS53123683A publication Critical patent/JPS53123683A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent disconnection, short, etc., with unevenness reduced by burying the unevenness, generated by a conduction pattern, with an insulation layer.
JP3871777A 1977-04-05 1977-04-05 Manufacture of wiring substrate Pending JPS53123683A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3871777A JPS53123683A (en) 1977-04-05 1977-04-05 Manufacture of wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3871777A JPS53123683A (en) 1977-04-05 1977-04-05 Manufacture of wiring substrate

Publications (1)

Publication Number Publication Date
JPS53123683A true JPS53123683A (en) 1978-10-28

Family

ID=12533064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3871777A Pending JPS53123683A (en) 1977-04-05 1977-04-05 Manufacture of wiring substrate

Country Status (1)

Country Link
JP (1) JPS53123683A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126944A (en) * 1980-03-12 1981-10-05 Fujitsu Ltd Production of semiconductor device
JPS57162445A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Manufacture of semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48103279A (en) * 1972-04-12 1973-12-25

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48103279A (en) * 1972-04-12 1973-12-25

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56126944A (en) * 1980-03-12 1981-10-05 Fujitsu Ltd Production of semiconductor device
JPS6322067B2 (en) * 1980-03-12 1988-05-10 Fujitsu Ltd
JPS57162445A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Manufacture of semiconductor device

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