JPS559643A - Production of heat-resistant resin paste - Google Patents
Production of heat-resistant resin pasteInfo
- Publication number
- JPS559643A JPS559643A JP8212378A JP8212378A JPS559643A JP S559643 A JPS559643 A JP S559643A JP 8212378 A JP8212378 A JP 8212378A JP 8212378 A JP8212378 A JP 8212378A JP S559643 A JPS559643 A JP S559643A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- solvent
- added
- solution
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006015 heat resistant resin Polymers 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 4
- 229920000642 polymer Polymers 0.000 abstract 4
- 239000002798 polar solvent Substances 0.000 abstract 3
- 239000002904 solvent Substances 0.000 abstract 3
- 125000003118 aryl group Chemical group 0.000 abstract 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 abstract 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- 239000004962 Polyamide-imide Substances 0.000 abstract 1
- 239000004760 aramid Substances 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 229910052796 boron Inorganic materials 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000011133 lead Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 150000001247 metal acetylides Chemical class 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 150000004767 nitrides Chemical class 0.000 abstract 1
- 229920002312 polyamide-imide Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212378A JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8212378A JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS559643A true JPS559643A (en) | 1980-01-23 |
| JPS6157866B2 JPS6157866B2 (enExample) | 1986-12-09 |
Family
ID=13765631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8212378A Granted JPS559643A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS559643A (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (ja) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | 導電性接着剤組成物 |
| JPS61181135A (ja) * | 1985-02-06 | 1986-08-13 | Matsushita Electric Ind Co Ltd | 印刷配線基板 |
| JPS62106960A (ja) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | 耐熱性樹脂組成物 |
| JPS62179564A (ja) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | 耐熱性フレキシブル樹脂組成物 |
| JPS62261197A (ja) * | 1986-05-01 | 1987-11-13 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 多層セラミツク構造体の製造方法 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01110582A (ja) * | 1987-10-26 | 1989-04-27 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH01118586A (ja) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH0232216A (ja) * | 1988-07-22 | 1990-02-02 | Tokyo Keiso Co Ltd | 凝縮性成分及びミストを含むガスの流量測定方法及びその装置 |
| JPH02252786A (ja) * | 1989-03-28 | 1990-10-11 | Hitachi Ltd | 耐熱性接着剤 |
| JP2001302807A (ja) * | 2000-04-18 | 2001-10-31 | Hitachi Chem Co Ltd | 樹脂ペーストの製造法及び樹脂ペースト |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62197071U (enExample) * | 1986-06-06 | 1987-12-15 |
-
1978
- 1978-07-07 JP JP8212378A patent/JPS559643A/ja active Granted
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60120778A (ja) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | 導電性接着剤組成物 |
| JPS61181135A (ja) * | 1985-02-06 | 1986-08-13 | Matsushita Electric Ind Co Ltd | 印刷配線基板 |
| JPS62106960A (ja) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | 耐熱性樹脂組成物 |
| JPS62179564A (ja) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | 耐熱性フレキシブル樹脂組成物 |
| JPS62261197A (ja) * | 1986-05-01 | 1987-11-13 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 多層セラミツク構造体の製造方法 |
| JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
| JPH01110582A (ja) * | 1987-10-26 | 1989-04-27 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH01118586A (ja) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | 耐熱性接着剤 |
| JPH0232216A (ja) * | 1988-07-22 | 1990-02-02 | Tokyo Keiso Co Ltd | 凝縮性成分及びミストを含むガスの流量測定方法及びその装置 |
| JPH02252786A (ja) * | 1989-03-28 | 1990-10-11 | Hitachi Ltd | 耐熱性接着剤 |
| JP2001302807A (ja) * | 2000-04-18 | 2001-10-31 | Hitachi Chem Co Ltd | 樹脂ペーストの製造法及び樹脂ペースト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6157866B2 (enExample) | 1986-12-09 |
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