JPS6440586A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPS6440586A JPS6440586A JP19866387A JP19866387A JPS6440586A JP S6440586 A JPS6440586 A JP S6440586A JP 19866387 A JP19866387 A JP 19866387A JP 19866387 A JP19866387 A JP 19866387A JP S6440586 A JPS6440586 A JP S6440586A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- polyimide precursor
- powder
- aluminum powder
- nitride powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 239000000853 adhesive Substances 0.000 title 1
- 230000001070 adhesive effect Effects 0.000 title 1
- 239000004642 Polyimide Substances 0.000 abstract 5
- 239000000945 filler Substances 0.000 abstract 5
- 229920001721 polyimide Polymers 0.000 abstract 5
- 239000002243 precursor Substances 0.000 abstract 5
- 239000000843 powder Substances 0.000 abstract 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 2
- 229910052582 BN Inorganic materials 0.000 abstract 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 abstract 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 150000004984 aromatic diamines Chemical class 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 229910003460 diamond Inorganic materials 0.000 abstract 1
- 239000010432 diamond Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 abstract 1
- 229910010271 silicon carbide Inorganic materials 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003786 synthesis reaction Methods 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To obtain the titled composition for the bonding of a semiconductor element and a substrate member, enabling hermetic sealing without lowering heat-resistance and thermal conductivity and useful for the assembly of a semiconductor device, by compounding a polyimide precursor with a specific filler such as aluminum powder. CONSTITUTION:A polyimide precursor is produced by reacting an aromatic diamine with 3,3',4,4'-biphenyltetracarboxylic acid dianhydride. The polyimide precursor is compounded with a filler selected from aluminum powder, silicon nitride powder, boron nitride powder, silicon carbide power and diamond powder to obtain the objective composition. The amount of the filler is 20-50vol.% based on the sum of the polyimide precursor and the filler. The maximum particle diameter of the filler is preferably <40mum and the solvent for the synthesis of the polyimide precursor is preferably N-methyl-2-pyrrolidone, etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866387A JPS6440586A (en) | 1987-08-07 | 1987-08-07 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19866387A JPS6440586A (en) | 1987-08-07 | 1987-08-07 | Adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6440586A true JPS6440586A (en) | 1989-02-10 |
Family
ID=16394972
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19866387A Pending JPS6440586A (en) | 1987-08-07 | 1987-08-07 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6440586A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6385753U (en) * | 1986-11-25 | 1988-06-04 | ||
| JPH0377276A (en) * | 1989-08-17 | 1991-04-02 | Tokai Carbon Co Ltd | Method for manufacturing carbonaceous composite material for fuel cells |
| JPH059455A (en) * | 1991-07-02 | 1993-01-19 | Sumitomo Bakelite Co Ltd | Adhesive for airtight sealing |
| JPH05117599A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05117598A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05117597A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05335354A (en) * | 1992-06-02 | 1993-12-17 | Sumitomo Bakelite Co Ltd | Semiconductor device with adhesive |
| JP2004161830A (en) * | 2002-11-11 | 2004-06-10 | Murata Mfg Co Ltd | Method for manufacturing polyimide precursor paste, polyimide precursor paste, and polyimide film made by using it |
| US7252795B2 (en) | 2003-08-26 | 2007-08-07 | Matsushita Electric Industrial Co., Ltd. | High thermal conductivite element, method for manufacturing same, and heat radiating system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS559642A (en) * | 1978-07-07 | 1980-01-23 | Asahi Chem Ind Co Ltd | Production of heat-resistant resin paste |
| JPS559643A (en) * | 1978-07-07 | 1980-01-23 | Asahi Chem Ind Co Ltd | Production of heat-resistant resin paste |
| JPS5860563A (en) * | 1981-10-06 | 1983-04-11 | Mitsubishi Electric Corp | Protective film for electronic components |
| JPS5922974A (en) * | 1982-07-29 | 1984-02-06 | Toshiba Corp | Heat-resistant adhesive |
| JPS6049031A (en) * | 1983-08-29 | 1985-03-18 | Japan Synthetic Rubber Co Ltd | Manufacture of polyamic acid solution |
| JPS60139755A (en) * | 1983-12-27 | 1985-07-24 | Ube Ind Ltd | Electrical insulating composition |
| JPS60206884A (en) * | 1984-03-30 | 1985-10-18 | Nitto Electric Ind Co Ltd | Electrically conductive paste composition |
| JPS61145266A (en) * | 1984-12-19 | 1986-07-02 | Sumitomo Electric Ind Ltd | glue |
-
1987
- 1987-08-07 JP JP19866387A patent/JPS6440586A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS559642A (en) * | 1978-07-07 | 1980-01-23 | Asahi Chem Ind Co Ltd | Production of heat-resistant resin paste |
| JPS559643A (en) * | 1978-07-07 | 1980-01-23 | Asahi Chem Ind Co Ltd | Production of heat-resistant resin paste |
| JPS5860563A (en) * | 1981-10-06 | 1983-04-11 | Mitsubishi Electric Corp | Protective film for electronic components |
| JPS5922974A (en) * | 1982-07-29 | 1984-02-06 | Toshiba Corp | Heat-resistant adhesive |
| JPS6049031A (en) * | 1983-08-29 | 1985-03-18 | Japan Synthetic Rubber Co Ltd | Manufacture of polyamic acid solution |
| JPS60139755A (en) * | 1983-12-27 | 1985-07-24 | Ube Ind Ltd | Electrical insulating composition |
| JPS60206884A (en) * | 1984-03-30 | 1985-10-18 | Nitto Electric Ind Co Ltd | Electrically conductive paste composition |
| JPS61145266A (en) * | 1984-12-19 | 1986-07-02 | Sumitomo Electric Ind Ltd | glue |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6385753U (en) * | 1986-11-25 | 1988-06-04 | ||
| JPH0377276A (en) * | 1989-08-17 | 1991-04-02 | Tokai Carbon Co Ltd | Method for manufacturing carbonaceous composite material for fuel cells |
| JPH059455A (en) * | 1991-07-02 | 1993-01-19 | Sumitomo Bakelite Co Ltd | Adhesive for airtight sealing |
| JPH05117599A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05117598A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05117597A (en) * | 1991-10-29 | 1993-05-14 | Sumitomo Bakelite Co Ltd | Film adhesive having high thermal conductivity and bondable by hot melt bonding |
| JPH05335354A (en) * | 1992-06-02 | 1993-12-17 | Sumitomo Bakelite Co Ltd | Semiconductor device with adhesive |
| JP2004161830A (en) * | 2002-11-11 | 2004-06-10 | Murata Mfg Co Ltd | Method for manufacturing polyimide precursor paste, polyimide precursor paste, and polyimide film made by using it |
| US7252795B2 (en) | 2003-08-26 | 2007-08-07 | Matsushita Electric Industrial Co., Ltd. | High thermal conductivite element, method for manufacturing same, and heat radiating system |
| US7402340B2 (en) | 2003-08-26 | 2008-07-22 | Matsushita Electric Industrial Co., Ltd. | High thermal conductive element, method for manufacturing same, and heat radiating system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5855821A (en) | Materials for semiconductor device assemblies | |
| CN104152103B (en) | A kind of add-on type bi-component heat conduction casting glue and preparation method thereof | |
| US9085719B2 (en) | Thermally reversible thermal interface materials with improved moisture resistance | |
| JP6299607B2 (en) | Adhesive composition, adhesive sheet, and cured product and semiconductor device using the same | |
| US6620946B2 (en) | Low shrinkage thermosetting resin compositions and methods of use thereof | |
| JPS6440586A (en) | Adhesive composition | |
| KR20030084540A (en) | Highly Heat-resistant Plasma Etching Electrode and Dry Etching Device Including the Same | |
| JPS62501713A (en) | How to bond two substrates using benzocyclobutene monomer | |
| KR102215781B1 (en) | Phosphor sheet, LED chip and LED package using the same, manufacturing method of LED package, and light emitting device including LED package, backlight unit and display | |
| CN103275629A (en) | High thermal conductivity cellophane and preparation method thereof | |
| MY118700A (en) | Thermosetting resin compositions | |
| KR900008148B1 (en) | Semiconductor device | |
| JP2732021B2 (en) | Adhesive tape and liquid adhesive for electronic parts | |
| JPS5844712B2 (en) | adhesive composition | |
| EP1508584A1 (en) | Adhesive resin and film adhesives made by using the same | |
| JPS6483634A (en) | Aluminum composite material combining low thermal expansion property with high heat dissipation property | |
| JPH05235212A (en) | Resin composition with improved heat resistance property for sealing semiconductor device | |
| JPH02252786A (en) | Heat-resistant adhesive | |
| JP2504913B2 (en) | Heat sink mounted semiconductor device, manufacturing method thereof, and heat sink for semiconductor device | |
| WO2019044646A1 (en) | Composition for heat dissipation members, heat dissipation member, electronic device, and method for producing heat dissipation member | |
| CN115612248A (en) | Semiconductor device | |
| JP2868977B2 (en) | Film adhesive | |
| JPH0967560A (en) | Adhesive tape for electronic parts and liquid adhesive | |
| EP1624038A1 (en) | Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same | |
| WO2003029255A1 (en) | Vinyl silane compounds containing epoxy functionality |