JPS559642A - Production of heat-resistant resin paste - Google Patents
Production of heat-resistant resin pasteInfo
- Publication number
- JPS559642A JPS559642A JP8212278A JP8212278A JPS559642A JP S559642 A JPS559642 A JP S559642A JP 8212278 A JP8212278 A JP 8212278A JP 8212278 A JP8212278 A JP 8212278A JP S559642 A JPS559642 A JP S559642A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- parts
- solvent
- aromatic
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: A mixture of heat-treated particles imparting electric characteristics is dispersed in a heat resistant polymer soluble in organic polar solvent and a solvent, thus producing title paste being capable of low temperature treatment and being sintered to give the stability in electric properties for long periods of time.
CONSTITUTION: (A) 100 parts by wt of at least one of heat-resistant polymer selected from aromatic polyimide, aromatic polyamideimide and aromatic polyamideacid soluble in organic polar solvent are dissolved in (B) 100W5000 parts of a solvent of dimethyl formamide, cresol or the like and to the solution are added (C) 5W2000 parts of a mixture of particles imparting electric characteristics consisting of at least two selected from metals as gold, silver, lead, etc., their oxides, nitrides, carbide and carbon and boron which are previously heat treated at 500W2000°C and have particle sizes of 20 ÅW500 microns.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8212278A JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8212278A JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS559642A true JPS559642A (en) | 1980-01-23 |
JPS6157865B2 JPS6157865B2 (en) | 1986-12-09 |
Family
ID=13765601
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8212278A Granted JPS559642A (en) | 1978-07-07 | 1978-07-07 | Production of heat-resistant resin paste |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS559642A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60120778A (en) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | Electrically conductive adhesive composition |
JPS61168881A (en) * | 1985-01-21 | 1986-07-30 | 三菱電機株式会社 | Compressed terminal structure |
JPS62106960A (en) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | Heat-resistant resin composition |
JPS62179564A (en) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | Heat-resistant flexible resin composition |
JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
JPH01118586A (en) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | Heat-resistant adhesive |
JPH04222889A (en) * | 1990-12-25 | 1992-08-12 | Sumitomo Bakelite Co Ltd | Electrically conductive resin paste |
-
1978
- 1978-07-07 JP JP8212278A patent/JPS559642A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60120778A (en) * | 1983-12-05 | 1985-06-28 | Hitachi Chem Co Ltd | Electrically conductive adhesive composition |
JPS61168881A (en) * | 1985-01-21 | 1986-07-30 | 三菱電機株式会社 | Compressed terminal structure |
JPS62106960A (en) * | 1985-11-01 | 1987-05-18 | Nippon Koudoshi Kogyo Kk | Heat-resistant resin composition |
JPS62179564A (en) * | 1986-02-04 | 1987-08-06 | Nippon Koudoshi Kogyo Kk | Heat-resistant flexible resin composition |
JPS6440586A (en) * | 1987-08-07 | 1989-02-10 | Hitachi Chemical Co Ltd | Adhesive composition |
JPH01118586A (en) * | 1987-10-30 | 1989-05-11 | Toshiba Chem Corp | Heat-resistant adhesive |
JPH04222889A (en) * | 1990-12-25 | 1992-08-12 | Sumitomo Bakelite Co Ltd | Electrically conductive resin paste |
Also Published As
Publication number | Publication date |
---|---|
JPS6157865B2 (en) | 1986-12-09 |
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