JPS5682855A - Conductive paint - Google Patents

Conductive paint

Info

Publication number
JPS5682855A
JPS5682855A JP16112279A JP16112279A JPS5682855A JP S5682855 A JPS5682855 A JP S5682855A JP 16112279 A JP16112279 A JP 16112279A JP 16112279 A JP16112279 A JP 16112279A JP S5682855 A JPS5682855 A JP S5682855A
Authority
JP
Japan
Prior art keywords
resin
flux
conductive paint
copper powder
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16112279A
Other languages
Japanese (ja)
Inventor
Eiichi Tsunashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16112279A priority Critical patent/JPS5682855A/en
Publication of JPS5682855A publication Critical patent/JPS5682855A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To prepare a conductive paint having a low electrical resistance of a conductor and excellent solderability, at a low cost, by dispersing conductive powder coated with a flux which vaporizes at the soldering temperature, in a mixture of a resin binder and a solvent.
CONSTITUTION: Conductive powder (e.g. copper powder) is coated with a flux which vaporizes at the soldering temperature (e.g. a resin flux such as natural rosin), and dispersed in a mixture of a resin (such as epoxy resin) and a solvent. The average particle diameter of the copper powder is pref. 1W10μ, and the content of the copper powder in the conductive paint is pref. 65W95wt%.
COPYRIGHT: (C)1981,JPO&Japio
JP16112279A 1979-12-11 1979-12-11 Conductive paint Pending JPS5682855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16112279A JPS5682855A (en) 1979-12-11 1979-12-11 Conductive paint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16112279A JPS5682855A (en) 1979-12-11 1979-12-11 Conductive paint

Publications (1)

Publication Number Publication Date
JPS5682855A true JPS5682855A (en) 1981-07-06

Family

ID=15729013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16112279A Pending JPS5682855A (en) 1979-12-11 1979-12-11 Conductive paint

Country Status (1)

Country Link
JP (1) JPS5682855A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168073A (en) * 1987-12-23 1989-07-03 Matsushita Electric Ind Co Ltd Manufacture of photovoltaic device
JPH01169972A (en) * 1987-12-24 1989-07-05 Matsushita Electric Ind Co Ltd Manufacture of photovoltaic device
JPH01169971A (en) * 1987-12-24 1989-07-05 Matsushita Electric Ind Co Ltd Manufacture of photosensor
JPH04262890A (en) * 1990-09-27 1992-09-18 Motorola Inc Flux agent and adhesive containing metal particle
US9484170B2 (en) 2011-01-28 2016-11-01 Yazaki Corporation Fuse securing structure for power source circuit cutoff device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501040A (en) * 1973-03-14 1975-01-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501040A (en) * 1973-03-14 1975-01-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168073A (en) * 1987-12-23 1989-07-03 Matsushita Electric Ind Co Ltd Manufacture of photovoltaic device
JPH01169972A (en) * 1987-12-24 1989-07-05 Matsushita Electric Ind Co Ltd Manufacture of photovoltaic device
JPH01169971A (en) * 1987-12-24 1989-07-05 Matsushita Electric Ind Co Ltd Manufacture of photosensor
JPH04262890A (en) * 1990-09-27 1992-09-18 Motorola Inc Flux agent and adhesive containing metal particle
US9484170B2 (en) 2011-01-28 2016-11-01 Yazaki Corporation Fuse securing structure for power source circuit cutoff device

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