JPS5591972A - Removing method for vacuum deposited metal layer from vacuum deposition mask - Google Patents

Removing method for vacuum deposited metal layer from vacuum deposition mask

Info

Publication number
JPS5591972A
JPS5591972A JP16564878A JP16564878A JPS5591972A JP S5591972 A JPS5591972 A JP S5591972A JP 16564878 A JP16564878 A JP 16564878A JP 16564878 A JP16564878 A JP 16564878A JP S5591972 A JPS5591972 A JP S5591972A
Authority
JP
Japan
Prior art keywords
mask
metal
tape
deposited
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16564878A
Other languages
Japanese (ja)
Inventor
Takeshi Obata
Kazuyuki Nonaka
Nobumasa Oshima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16564878A priority Critical patent/JPS5591972A/en
Publication of JPS5591972A publication Critical patent/JPS5591972A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To remove even a metal deposited on a stepped portion and an end surface of a deposition mask having steps at its punched portion without damaging the mask by press.-bonding an elastic self-adhering tape onto the mask to stick the deposited metal to the tape and exfoliating the tape when the deposited metal layer on the mask is removed. CONSTITUTION:On the surfade of deposition mask 1 having steps at its punched portion, to weaken the bonding strength to deposited metal 2 surface treating layer 3 is formed beforehand. Prior to exfoliation of the layer of metal 2, stepped portion 2A and end surface 2B, layer 3 alone is swelled by dipping in acid or alkali. Thus, the bonding strength between metal 2 and mask 1 is weakened. Elastic self-adhering tape 4 is then press.-bonded onto mask 1. By exfoliating 5 tape 4 from mask 1 metal 2, 2A, 2B is simultaneously exfoliated 5 together with tape 4. By this method the accuracy of mask 1 can be maintained at its original state for ever, and a deposited electrode pattern can be manufactured always uniformly with high reproducibility.
JP16564878A 1978-12-28 1978-12-28 Removing method for vacuum deposited metal layer from vacuum deposition mask Pending JPS5591972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16564878A JPS5591972A (en) 1978-12-28 1978-12-28 Removing method for vacuum deposited metal layer from vacuum deposition mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16564878A JPS5591972A (en) 1978-12-28 1978-12-28 Removing method for vacuum deposited metal layer from vacuum deposition mask

Publications (1)

Publication Number Publication Date
JPS5591972A true JPS5591972A (en) 1980-07-11

Family

ID=15816346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16564878A Pending JPS5591972A (en) 1978-12-28 1978-12-28 Removing method for vacuum deposited metal layer from vacuum deposition mask

Country Status (1)

Country Link
JP (1) JPS5591972A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004061149A1 (en) * 2002-12-31 2004-07-22 Eastman Kodak Company Flexible frame for mounting a deposition mask
JP2009001895A (en) * 2007-06-20 2009-01-08 Samsung Electro Mech Co Ltd Shadow mask

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004061149A1 (en) * 2002-12-31 2004-07-22 Eastman Kodak Company Flexible frame for mounting a deposition mask
US6926840B2 (en) 2002-12-31 2005-08-09 Eastman Kodak Company Flexible frame for mounting a deposition mask
JP2009001895A (en) * 2007-06-20 2009-01-08 Samsung Electro Mech Co Ltd Shadow mask

Similar Documents

Publication Publication Date Title
GB1476284A (en) Procuction of structure on a substrate
JPS5591972A (en) Removing method for vacuum deposited metal layer from vacuum deposition mask
JPS57211787A (en) Amorphous silicon diode
JPS54146990A (en) Production of elastic surface wave device
JPS574116A (en) Manufacture of semiconductor substrate
JPS5690539A (en) Production of semiconductor device
JPS56100421A (en) Plasma etching method
JPS5713740A (en) Forming method for conductor pattern
JPS6442195A (en) Method of forming pattern by lift-off
JPS5566113A (en) Manufacture of elastic surface wave device
DE3669895D1 (en) METHOD FOR METALLIZING AN ELECTRICALLY BAD CONDUCTING SUBSTRATE FROM AN INORGANIC MATERIAL.
JPS55109526A (en) Regenerating method for die
JPS5559718A (en) Producing method of semiconductor unit
JPS56140659A (en) Manufacture of semiconductor device
GB746072A (en) Improvements relating to the manufacture of dies for use in die forging
JPS5763912A (en) Electrode forming method
JPS5750478A (en) Manufacture of semiconductor device
JPS5633836A (en) Patterning method of gaas thermal oxide film
JPH04206358A (en) Manufacture of collector for lead accumulator
JPS6461646A (en) Method for laminating sample
JPS5678141A (en) Method of forming electrode for semiconductor device
JPS54162460A (en) Electrode forming method
NO974173D0 (en) Method of treating a surface of an aluminum substrate material, and forming a specular surface of the same
JPS56123376A (en) Etching method
JPS54162968A (en) Manufacture of semiconductor device