JPS6442195A - Method of forming pattern by lift-off - Google Patents

Method of forming pattern by lift-off

Info

Publication number
JPS6442195A
JPS6442195A JP19838587A JP19838587A JPS6442195A JP S6442195 A JPS6442195 A JP S6442195A JP 19838587 A JP19838587 A JP 19838587A JP 19838587 A JP19838587 A JP 19838587A JP S6442195 A JPS6442195 A JP S6442195A
Authority
JP
Japan
Prior art keywords
metal layer
substrate
resist pattern
lift
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19838587A
Other languages
Japanese (ja)
Inventor
Setsuo Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP19838587A priority Critical patent/JPS6442195A/en
Publication of JPS6442195A publication Critical patent/JPS6442195A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern

Abstract

PURPOSE:To facilitate forming of a pattern which has a high adhesion strength to a substrate by a method wherein a 1st metal layer is formed on the substrate surface and a resist pattern and a 2nd metal layer are successively formed on the 1st metal layer and the 2nd metal layer is lifted off. CONSTITUTION:A first metal layer 4 is formed on the clean surface of a substrate 1. After a resist pattern 2 and a 2nd metal layer 5 are successively formed, the 2nd metal layer 5 is lifted off by removing the resist pattern 2 and the 1st metal layer 4 is etched with the remaining 2nd metal layer 5 as a mask. With this constitution, a pattern which is reversal of the resist pattern and composed of the 1st metal layer with a high adhesion strength to the substrate can be obtained.
JP19838587A 1987-08-07 1987-08-07 Method of forming pattern by lift-off Pending JPS6442195A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19838587A JPS6442195A (en) 1987-08-07 1987-08-07 Method of forming pattern by lift-off

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19838587A JPS6442195A (en) 1987-08-07 1987-08-07 Method of forming pattern by lift-off

Publications (1)

Publication Number Publication Date
JPS6442195A true JPS6442195A (en) 1989-02-14

Family

ID=16390244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19838587A Pending JPS6442195A (en) 1987-08-07 1987-08-07 Method of forming pattern by lift-off

Country Status (1)

Country Link
JP (1) JPS6442195A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374093A (en) * 2001-06-13 2002-12-26 Bridgestone Corp Electromagnetic wave shielding light transmitting window material and its producing method
JP2002374094A (en) * 2001-06-13 2002-12-26 Bridgestone Corp Electromagnetic wave shielding light transmitting window material and its producing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002374093A (en) * 2001-06-13 2002-12-26 Bridgestone Corp Electromagnetic wave shielding light transmitting window material and its producing method
JP2002374094A (en) * 2001-06-13 2002-12-26 Bridgestone Corp Electromagnetic wave shielding light transmitting window material and its producing method

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