JPS5544752A - Manufacture of multilayer wiring type semiconductor - Google Patents
Manufacture of multilayer wiring type semiconductorInfo
- Publication number
- JPS5544752A JPS5544752A JP11822078A JP11822078A JPS5544752A JP S5544752 A JPS5544752 A JP S5544752A JP 11822078 A JP11822078 A JP 11822078A JP 11822078 A JP11822078 A JP 11822078A JP S5544752 A JPS5544752 A JP S5544752A
- Authority
- JP
- Japan
- Prior art keywords
- film
- photo
- range
- films
- layer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To make holes uniformly with one mask pattern on the through-hole range of nonporous alumina film and interlayer insulating film and to prevent the cutting of upper-layer wiring by inhibiting galvanic action by means of the photo- resist film on the reverse side of the films.
CONSTITUTION: Al film 4 is bonded to a semiconductor device having a semiconductor substrate 1, main insulating film 2 and diffused element range 3, and the surface thereof is changed into nonporous alumina film 5. Next, photo- resist film 6 is provided on the range to be formed the first layer wiring, and the range except the wiring is separated with porous alumina film. Next, the film 6 is removed, interlayer insulating film 8 is coated, and the film 9 is provided by coating Si oxide application liquid. Next, the reverse side of the semiconductor substrate 1 is coated with photo-resist film 10. Next, a hole pattern 11 of the photo-resist film is provided. Next, films 8 and 5 are simultaneously chemically etched. At this time, the corrosion speed of the film 9 is so high that the side face of the holes of the film 8 become inclined. Further, galvanic action is inhibited by the film 10. Next, the films 10 and 11 are removed, and upper-layer wiring 13 is provided in contact with through-hole portion.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11822078A JPS5544752A (en) | 1978-09-25 | 1978-09-25 | Manufacture of multilayer wiring type semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11822078A JPS5544752A (en) | 1978-09-25 | 1978-09-25 | Manufacture of multilayer wiring type semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5544752A true JPS5544752A (en) | 1980-03-29 |
Family
ID=14731185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11822078A Pending JPS5544752A (en) | 1978-09-25 | 1978-09-25 | Manufacture of multilayer wiring type semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5544752A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145873A (en) * | 1981-09-28 | 1982-09-09 | Takeda Chem Ind Ltd | Production of furfural derivative |
-
1978
- 1978-09-25 JP JP11822078A patent/JPS5544752A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57145873A (en) * | 1981-09-28 | 1982-09-09 | Takeda Chem Ind Ltd | Production of furfural derivative |
JPS5852995B2 (en) * | 1981-09-28 | 1983-11-26 | 武田薬品工業株式会社 | Method for producing furfural derivatives |
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