JPS5543811A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5543811A
JPS5543811A JP11578778A JP11578778A JPS5543811A JP S5543811 A JPS5543811 A JP S5543811A JP 11578778 A JP11578778 A JP 11578778A JP 11578778 A JP11578778 A JP 11578778A JP S5543811 A JPS5543811 A JP S5543811A
Authority
JP
Japan
Prior art keywords
electrode
tip
solder
connection
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11578778A
Other languages
Japanese (ja)
Other versions
JPS6059743B2 (en
Inventor
Muneo Oshima
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53115787A priority Critical patent/JPS6059743B2/en
Publication of JPS5543811A publication Critical patent/JPS5543811A/en
Publication of JPS6059743B2 publication Critical patent/JPS6059743B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To prolong fatigue breakage life due to repetitive displasement by controlling shape of a solder bump surrounding tip for electrical connection by a bump in the tip's center section.
CONSTITUTION: By changing size of solder bumps on an IC tip 1, respectively required volumes of bumps are achieved on an electrode 2 and a control electrode 11. On a base board on which pedestals are formed in positions corresponding to the electrode 2 and the control electrode 11, positioning is made with face down and heated to melt for completion of connection. As a solder column 9 is to have stretched connection intervals due to a solder column 10 if the control section, its fatigue breakage life can be prolonged.
COPYRIGHT: (C)1980,JPO&Japio
JP53115787A 1978-09-22 1978-09-22 Semiconductor integrated circuit device Expired JPS6059743B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53115787A JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53115787A JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5543811A true JPS5543811A (en) 1980-03-27
JPS6059743B2 JPS6059743B2 (en) 1985-12-26

Family

ID=14671050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53115787A Expired JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6059743B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
JP2018107371A (en) * 2016-12-28 2018-07-05 日亜化学工業株式会社 Light-emitting device and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353534B2 (en) * 1995-04-27 2002-12-03 株式会社日立製作所 Electronic circuit device and electronic circuit components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
JP2018107371A (en) * 2016-12-28 2018-07-05 日亜化学工業株式会社 Light-emitting device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6059743B2 (en) 1985-12-26

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