JPS5574165A - Hybrid integrated circuit structure - Google Patents

Hybrid integrated circuit structure

Info

Publication number
JPS5574165A
JPS5574165A JP14649578A JP14649578A JPS5574165A JP S5574165 A JPS5574165 A JP S5574165A JP 14649578 A JP14649578 A JP 14649578A JP 14649578 A JP14649578 A JP 14649578A JP S5574165 A JPS5574165 A JP S5574165A
Authority
JP
Japan
Prior art keywords
tips
auxiliary bumps
substrate
bumps
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14649578A
Other languages
Japanese (ja)
Inventor
Hirosuke Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14649578A priority Critical patent/JPS5574165A/en
Publication of JPS5574165A publication Critical patent/JPS5574165A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PURPOSE: To obtain a highly integrated hybrid IC by arranging other tips on the tips previously placed on the base substrate using auxiliary bumps.
CONSTITUTION: Resistance tips 12, circuit parts 14, etc. are placed on the wired substate 11, then capacitive tips 13 are further arranged to overlap the tip 12 by using auxiliary bumps 15. Solder 16 is used to connect the tips, circuit parts, and auxiliary bumps with the substrate through the metallized wiring 17. The auxiliary bumps and the tips are connected with solder also. Conductive paste can be effective. The auxiliary bumps 15 employing the same material as the substrate 11 provides a good resistance against thermal shock. In this manner of three-dimensional arrangement, the most appropriate proportion can be given to hybrid IC structure.
COPYRIGHT: (C)1980,JPO&Japio
JP14649578A 1978-11-29 1978-11-29 Hybrid integrated circuit structure Pending JPS5574165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14649578A JPS5574165A (en) 1978-11-29 1978-11-29 Hybrid integrated circuit structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14649578A JPS5574165A (en) 1978-11-29 1978-11-29 Hybrid integrated circuit structure

Publications (1)

Publication Number Publication Date
JPS5574165A true JPS5574165A (en) 1980-06-04

Family

ID=15408907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14649578A Pending JPS5574165A (en) 1978-11-29 1978-11-29 Hybrid integrated circuit structure

Country Status (1)

Country Link
JP (1) JPS5574165A (en)

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