JPS5518076A - Manufacture of field-effect transistor - Google Patents

Manufacture of field-effect transistor

Info

Publication number
JPS5518076A
JPS5518076A JP9175178A JP9175178A JPS5518076A JP S5518076 A JPS5518076 A JP S5518076A JP 9175178 A JP9175178 A JP 9175178A JP 9175178 A JP9175178 A JP 9175178A JP S5518076 A JPS5518076 A JP S5518076A
Authority
JP
Japan
Prior art keywords
layer
lifting
region
making
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9175178A
Other languages
Japanese (ja)
Inventor
Takeshi Suzuki
Hironobu Hatakeyama
Takashi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9175178A priority Critical patent/JPS5518076A/en
Publication of JPS5518076A publication Critical patent/JPS5518076A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make a gate electrode without lifting-off and improve the yield, by growing an N-type layer on a semi-insulating GaAs substrate, providing a source and a drain electrodes on the N-type layer and making the gate electrode by plating on the layer between the former electrodes.
CONSTITUTION: The N+-layer 2 is grown on the semi-insulating GaAs substrate 1. The source electrode 3, the drain electrode 4 and a peripheral frame 6 for facilitating the lifting-off are made on the layer 2 by the lifting-off and photoengraving. At that time, a layer part 2 for a gate making region 5 is left under the electrodes 3, 4. The thickness of the other parts of the layer 2 is reduced by etching so that the layer parts are left as electroconductive layers 9. The non-gate part of the region 5 is coated with a resist film 7 and the other part of the region is etched, thereby making a recess 10. A metal film 11 for the gate electrode is coated in the recess 10 by electrolytic plating through the electroconductive layers 9. These layers 9 are then removed. A plurality of GaAs field-effect transistors are thus manufactured on the substrate 1.
COPYRIGHT: (C)1980,JPO&Japio
JP9175178A 1978-07-26 1978-07-26 Manufacture of field-effect transistor Pending JPS5518076A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9175178A JPS5518076A (en) 1978-07-26 1978-07-26 Manufacture of field-effect transistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9175178A JPS5518076A (en) 1978-07-26 1978-07-26 Manufacture of field-effect transistor

Publications (1)

Publication Number Publication Date
JPS5518076A true JPS5518076A (en) 1980-02-07

Family

ID=14035232

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9175178A Pending JPS5518076A (en) 1978-07-26 1978-07-26 Manufacture of field-effect transistor

Country Status (1)

Country Link
JP (1) JPS5518076A (en)

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