JPS55158653A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS55158653A JPS55158653A JP6729479A JP6729479A JPS55158653A JP S55158653 A JPS55158653 A JP S55158653A JP 6729479 A JP6729479 A JP 6729479A JP 6729479 A JP6729479 A JP 6729479A JP S55158653 A JPS55158653 A JP S55158653A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- electronic parts
- overflow
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6729479A JPS55158653A (en) | 1979-05-30 | 1979-05-30 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6729479A JPS55158653A (en) | 1979-05-30 | 1979-05-30 | Hybrid integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55158653A true JPS55158653A (en) | 1980-12-10 |
Family
ID=13340815
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6729479A Pending JPS55158653A (en) | 1979-05-30 | 1979-05-30 | Hybrid integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55158653A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59214288A (ja) * | 1983-05-20 | 1984-12-04 | 松下電器産業株式会社 | プリント基板装置 |
JPS6096841U (ja) * | 1983-12-09 | 1985-07-02 | 株式会社三社電機製作所 | 半導体装置 |
JPS60106327U (ja) * | 1983-12-22 | 1985-07-19 | ティーディーケイ株式会社 | コンデンサ |
JPH02105495A (ja) * | 1988-10-13 | 1990-04-18 | Nec Corp | 混成集積回路装置 |
-
1979
- 1979-05-30 JP JP6729479A patent/JPS55158653A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59214288A (ja) * | 1983-05-20 | 1984-12-04 | 松下電器産業株式会社 | プリント基板装置 |
JPS6096841U (ja) * | 1983-12-09 | 1985-07-02 | 株式会社三社電機製作所 | 半導体装置 |
JPS60106327U (ja) * | 1983-12-22 | 1985-07-19 | ティーディーケイ株式会社 | コンデンサ |
JPH02105495A (ja) * | 1988-10-13 | 1990-04-18 | Nec Corp | 混成集積回路装置 |
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