JPS55147530A - Production of multilayer board - Google Patents
Production of multilayer boardInfo
- Publication number
- JPS55147530A JPS55147530A JP5546279A JP5546279A JPS55147530A JP S55147530 A JPS55147530 A JP S55147530A JP 5546279 A JP5546279 A JP 5546279A JP 5546279 A JP5546279 A JP 5546279A JP S55147530 A JPS55147530 A JP S55147530A
- Authority
- JP
- Japan
- Prior art keywords
- clad laminate
- prepared
- copper
- resistance
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5546279A JPS55147530A (en) | 1979-05-07 | 1979-05-07 | Production of multilayer board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5546279A JPS55147530A (en) | 1979-05-07 | 1979-05-07 | Production of multilayer board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55147530A true JPS55147530A (en) | 1980-11-17 |
Family
ID=12999262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5546279A Pending JPS55147530A (en) | 1979-05-07 | 1979-05-07 | Production of multilayer board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55147530A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61181632A (ja) * | 1985-02-07 | 1986-08-14 | Mitsubishi Electric Corp | 多層プリント配線板の製造方法 |
-
1979
- 1979-05-07 JP JP5546279A patent/JPS55147530A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61181632A (ja) * | 1985-02-07 | 1986-08-14 | Mitsubishi Electric Corp | 多層プリント配線板の製造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS55147530A (en) | Production of multilayer board | |
JPH08157621A (ja) | プリプレグ並びにこれを用いたプリント基板及びカバーレイフィルム | |
JPH05318640A (ja) | 積層板 | |
JPH04163005A (ja) | プリプレグ用の基材 | |
JPH02182409A (ja) | 基材へのワニス含浸方法 | |
JPH02133439A (ja) | 電気用積層板の製造方法 | |
JPH02277294A (ja) | プリント配線板の製造方法 | |
JPS63162731A (ja) | 熱硬化性樹脂積層板の製造方法 | |
JPH0771839B2 (ja) | 積層板の製造方法 | |
JPH02182407A (ja) | 基材へのワニス含浸方法 | |
JPH01150387A (ja) | プリント配線板 | |
JPS6455235A (en) | Laminate | |
JPH05162245A (ja) | 積層板 | |
JPS588615A (ja) | 布基材積層板の製造方法 | |
JPH06260765A (ja) | 多層配線基板及び多層配線板の製造方法 | |
JPH05315717A (ja) | 電気用積層板 | |
JPS63224936A (ja) | 積層板 | |
JPH01255297A (ja) | 多層配線基板の製造方法 | |
JPH03183193A (ja) | 多層配線基板 | |
JPS589755B2 (ja) | 新規な銅張積層板 | |
Traskos | A flex circuit composite based on a fiber blend | |
JPH08197680A (ja) | 金属箔張り積層板の連続製造方法 | |
JPH0682916B2 (ja) | 積層板用の金属箔および金属張り積層板 | |
JPS61237608A (ja) | 樹脂含浸基材 | |
JPH01215829A (ja) | プリプレグの製造方法 |