JPS55132083A - Light emitting diode substrate - Google Patents

Light emitting diode substrate

Info

Publication number
JPS55132083A
JPS55132083A JP3896779A JP3896779A JPS55132083A JP S55132083 A JPS55132083 A JP S55132083A JP 3896779 A JP3896779 A JP 3896779A JP 3896779 A JP3896779 A JP 3896779A JP S55132083 A JPS55132083 A JP S55132083A
Authority
JP
Japan
Prior art keywords
layer
constitution
led
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3896779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6133274B2 (enrdf_load_stackoverflow
Inventor
Masaaki Umezaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP3896779A priority Critical patent/JPS55132083A/ja
Publication of JPS55132083A publication Critical patent/JPS55132083A/ja
Publication of JPS6133274B2 publication Critical patent/JPS6133274B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP3896779A 1979-03-30 1979-03-30 Light emitting diode substrate Granted JPS55132083A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3896779A JPS55132083A (en) 1979-03-30 1979-03-30 Light emitting diode substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3896779A JPS55132083A (en) 1979-03-30 1979-03-30 Light emitting diode substrate

Publications (2)

Publication Number Publication Date
JPS55132083A true JPS55132083A (en) 1980-10-14
JPS6133274B2 JPS6133274B2 (enrdf_load_stackoverflow) 1986-08-01

Family

ID=12539922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3896779A Granted JPS55132083A (en) 1979-03-30 1979-03-30 Light emitting diode substrate

Country Status (1)

Country Link
JP (1) JPS55132083A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994381U (ja) * 1982-12-17 1984-06-27 株式会社東芝 発光表示装置
JPS61116701A (ja) * 1984-11-12 1986-06-04 株式会社小糸製作所 車輛用灯具
JPS63101987U (enrdf_load_stackoverflow) * 1986-12-22 1988-07-02
EP1087447A4 (en) * 1999-03-18 2007-03-07 Rohm Co Ltd PHOTOEMETTER SEMICONDUCTOR CHIP
JP2007129053A (ja) * 2005-11-02 2007-05-24 Citizen Electronics Co Ltd Ｌｅｄ発光装置。
KR101237685B1 (ko) * 2011-03-29 2013-02-26 삼성전기주식회사 방열 기판 및 그 제조방법
WO2014083714A1 (ja) 2012-11-27 2014-06-05 シチズン電子株式会社 実装基板及びこの実装基板を用いた発光装置
US10084122B2 (en) 2014-07-17 2018-09-25 Citizen Electronics Co., Ltd. Light-emitting apparatus and method of manufacturing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61105967U (enrdf_load_stackoverflow) * 1984-12-13 1986-07-05

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994381U (ja) * 1982-12-17 1984-06-27 株式会社東芝 発光表示装置
JPS61116701A (ja) * 1984-11-12 1986-06-04 株式会社小糸製作所 車輛用灯具
JPS63101987U (enrdf_load_stackoverflow) * 1986-12-22 1988-07-02
EP1087447A4 (en) * 1999-03-18 2007-03-07 Rohm Co Ltd PHOTOEMETTER SEMICONDUCTOR CHIP
JP2007129053A (ja) * 2005-11-02 2007-05-24 Citizen Electronics Co Ltd Ｌｅｄ発光装置。
KR101237685B1 (ko) * 2011-03-29 2013-02-26 삼성전기주식회사 방열 기판 및 그 제조방법
WO2014083714A1 (ja) 2012-11-27 2014-06-05 シチズン電子株式会社 実装基板及びこの実装基板を用いた発光装置
US9368707B2 (en) 2012-11-27 2016-06-14 Citizen Electronics Co., Ltd. Mounting substrate and light-emitting device using the same
JPWO2014083714A1 (ja) * 2012-11-27 2017-01-05 シチズン電子株式会社 実装基板及びこの実装基板を用いた発光装置
US10084122B2 (en) 2014-07-17 2018-09-25 Citizen Electronics Co., Ltd. Light-emitting apparatus and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6133274B2 (enrdf_load_stackoverflow) 1986-08-01

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