JPS55100239A - Seal bonding glass composition - Google Patents
Seal bonding glass compositionInfo
- Publication number
- JPS55100239A JPS55100239A JP554279A JP554279A JPS55100239A JP S55100239 A JPS55100239 A JP S55100239A JP 554279 A JP554279 A JP 554279A JP 554279 A JP554279 A JP 554279A JP S55100239 A JPS55100239 A JP S55100239A
- Authority
- JP
- Japan
- Prior art keywords
- compsn
- glass
- glass composition
- low
- bonding glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 2
- KOPBYBDAPCDYFK-UHFFFAOYSA-N Cs2O Inorganic materials [O-2].[Cs+].[Cs+] KOPBYBDAPCDYFK-UHFFFAOYSA-N 0.000 abstract 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 abstract 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 229910007676 ZnO—SiO2 Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052878 cordierite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- AKUNKIJLSDQFLS-UHFFFAOYSA-M dicesium;hydroxide Chemical compound [OH-].[Cs+].[Cs+] AKUNKIJLSDQFLS-UHFFFAOYSA-M 0.000 abstract 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 abstract 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 abstract 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 abstract 1
- 229910000174 eucryptite Inorganic materials 0.000 abstract 1
- -1 having superior heat Inorganic materials 0.000 abstract 1
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 abstract 1
- 229910001953 rubidium(I) oxide Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
- 229910052644 β-spodumene Inorganic materials 0.000 abstract 1
Landscapes
- Ceramic Products (AREA)
- Glass Compositions (AREA)
Abstract
PURPOSE: To provide a glass compsn. capable of airtightly seal-bonding alumina, having superior heat, water and acid resistances and superior insulating and dielectric properties, and consisting of PbO-B2O3-ZnO-SiO2 type low m.p. glass powder and a cordierite-contg. refractory filler of low expansibility.
CONSTITUTION: The glass compsn. consists of low m.p. glass powder having a compsn. composed of, by wt., PbO 77.0W86.0%, B2O3 6.1W15.0%, ZnO 0.5W 6.9%, SiO2 0.5W3.0%, Al2O3 0W3.0%, RO (RO is one or more out of BaO, SrO, CaO and MgO) 0W2.0% SnO2 0W1.5% and R2O (R2O is one or more out of Li2O, Na2O, K2O, Rb2O and Cs2O) 0W1.0% and a refractory filler composed of, by wt., cordierite 2.0W3.0%, β-eucryptite 0W30%, β-spodumene 0W30%, zirconium 0W50% and lead titanate 0W50%.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP554279A JPS55100239A (en) | 1979-01-23 | 1979-01-23 | Seal bonding glass composition |
| US06/109,079 US4405722A (en) | 1979-01-23 | 1980-01-02 | Sealing glass compositions |
| DE19803002353 DE3002353A1 (en) | 1979-01-23 | 1980-01-23 | GASKET GLASS |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP554279A JPS55100239A (en) | 1979-01-23 | 1979-01-23 | Seal bonding glass composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55100239A true JPS55100239A (en) | 1980-07-31 |
| JPS6143298B2 JPS6143298B2 (en) | 1986-09-26 |
Family
ID=11614070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP554279A Granted JPS55100239A (en) | 1979-01-23 | 1979-01-23 | Seal bonding glass composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55100239A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167862A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03173161A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173157A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173162A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH06157082A (en) * | 1992-11-17 | 1994-06-03 | Ishizuka Glass Co Ltd | Method for forming gap in glass bonding |
| KR970042353A (en) * | 1995-12-15 | 1997-07-24 | 김익명 | Insulating Glass Composition |
-
1979
- 1979-01-23 JP JP554279A patent/JPS55100239A/en active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167862A (en) * | 1989-11-27 | 1991-07-19 | Kyocera Corp | Package for semiconductor-element |
| JPH03173161A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173157A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH03173162A (en) * | 1989-11-30 | 1991-07-26 | Kyocera Corp | Package for housing semiconductor element |
| JPH06157082A (en) * | 1992-11-17 | 1994-06-03 | Ishizuka Glass Co Ltd | Method for forming gap in glass bonding |
| KR970042353A (en) * | 1995-12-15 | 1997-07-24 | 김익명 | Insulating Glass Composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6143298B2 (en) | 1986-09-26 |
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