JPS55104945A - Seal bonding composition - Google Patents
Seal bonding compositionInfo
- Publication number
- JPS55104945A JPS55104945A JP877379A JP877379A JPS55104945A JP S55104945 A JPS55104945 A JP S55104945A JP 877379 A JP877379 A JP 877379A JP 877379 A JP877379 A JP 877379A JP S55104945 A JPS55104945 A JP S55104945A
- Authority
- JP
- Japan
- Prior art keywords
- seal bonding
- compsn
- low
- pbo
- zno
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910000272 alkali metal oxide Inorganic materials 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 abstract 2
- KOPBYBDAPCDYFK-UHFFFAOYSA-N Cs2O Inorganic materials [O-2].[Cs+].[Cs+] KOPBYBDAPCDYFK-UHFFFAOYSA-N 0.000 abstract 1
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 abstract 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 abstract 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 abstract 1
- 229910007676 ZnO—SiO2 Inorganic materials 0.000 abstract 1
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical compound [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052878 cordierite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- AKUNKIJLSDQFLS-UHFFFAOYSA-M dicesium;hydroxide Chemical compound [OH-].[Cs+].[Cs+] AKUNKIJLSDQFLS-UHFFFAOYSA-M 0.000 abstract 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 abstract 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 abstract 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 abstract 1
- 229910000174 eucryptite Inorganic materials 0.000 abstract 1
- NOTVAPJNGZMVSD-UHFFFAOYSA-N potassium monoxide Inorganic materials [K]O[K] NOTVAPJNGZMVSD-UHFFFAOYSA-N 0.000 abstract 1
- 229910001953 rubidium(I) oxide Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 229910052726 zirconium Inorganic materials 0.000 abstract 1
- 229910052644 β-spodumene Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Products (AREA)
- Glass Compositions (AREA)
- Sealing Material Composition (AREA)
Abstract
PURPOSE: To provide a seal bonding compsn. consisting of PbO-B2O3-ZnO-SiO2 type low m.p. glass powder and low expansion refractory filler powder, suitable for IC, and capable of completing airtight seal bonding to alumina by treatment at a relatively low temp.
CONSTITUTION: The compsn. consists of low m.p. glass powder having a compsn. composed of, by wt., PbO 77.0W86.0%, B2O3 6.0W15.0%, ZnO 7.0W12.0%, SiO2 0.5W3.0%, Al2O3 0W3.0%, RO 0W2.0% (RO is BaO, SrO, CaO or MgO), SnO2 0W1.5% and R2O 0W1.0% (R2O is Li2O, Na2O, K2O, Rb2O or Cs2O) and of low expansion refractory filler powder contg. cordierite 15.1W30%, β-eucryptite 0W 30%, β-spodumene 0W30%, zirconium 0W50% and lead titanate 0W50%.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP877379A JPS55104945A (en) | 1979-01-30 | 1979-01-30 | Seal bonding composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP877379A JPS55104945A (en) | 1979-01-30 | 1979-01-30 | Seal bonding composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55104945A true JPS55104945A (en) | 1980-08-11 |
| JPS6143299B2 JPS6143299B2 (en) | 1986-09-26 |
Family
ID=11702199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP877379A Granted JPS55104945A (en) | 1979-01-30 | 1979-01-30 | Seal bonding composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55104945A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58213682A (en) * | 1982-06-03 | 1983-12-12 | 岩城硝子株式会社 | Low temperature sealing composition |
| KR100446865B1 (en) * | 1999-08-23 | 2004-09-04 | 조선내화 주식회사 | Batch composition of injection refractories for tap hole area of blast furnace |
| JP2009011744A (en) * | 2007-07-09 | 2009-01-22 | Toshiba Consumer Electronics Holdings Corp | Drawer type kitchen equipment drier |
| CN102070302A (en) * | 2010-11-22 | 2011-05-25 | 珠海彩珠实业有限公司 | Transparent low-melting point glass powder for dielectric paste and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63132293U (en) * | 1987-02-21 | 1988-08-30 |
-
1979
- 1979-01-30 JP JP877379A patent/JPS55104945A/en active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58213682A (en) * | 1982-06-03 | 1983-12-12 | 岩城硝子株式会社 | Low temperature sealing composition |
| KR100446865B1 (en) * | 1999-08-23 | 2004-09-04 | 조선내화 주식회사 | Batch composition of injection refractories for tap hole area of blast furnace |
| JP2009011744A (en) * | 2007-07-09 | 2009-01-22 | Toshiba Consumer Electronics Holdings Corp | Drawer type kitchen equipment drier |
| CN102070302A (en) * | 2010-11-22 | 2011-05-25 | 珠海彩珠实业有限公司 | Transparent low-melting point glass powder for dielectric paste and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6143299B2 (en) | 1986-09-26 |
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